International Business Machines Corporation

Anurag Jain

Jon Alfred Casey

Leena Paivikki Buchwalter

John Ulrich Knickerbocker

Gareth Geoffrey Hougham

Stephen L Buchwalter

Sung Kwon Kang

Claudius Feger

Matteo Flotta

Kathleen Conlon Hinge

Jeffrey Donald Gelorme

Donald Francis Canaperi

Eric D Perfecto

Krystyna Waleria Semkow

Raymond R Horton

Kamalesh K Srivastava

Michael Berger

James Anthony Tornello

Jeffrey D Gelmore

The present disclosure relates generally to semiconductor, integrated circuits, and particularly, but not by way of limitation, to centrifugal methods of filling high-aspect ratio vias and trenches with powders, pastes, suspensions of materials to act as any of a conducting, structural support, or protective member of an electronic component.

Centrifugal method for filing high aspect ratio blind mirco vias powdered materials for circuit formation

Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formation

An etchant which includes an aqueous solution of between about 30% and about 38% concentrated hydrogen peroxide, said percentages being by volume, based on the total volume of the solution; between about 3.5 ml and about 20 ml per liter of phosphoric acid; and an amount of potassium hydroxide to adjust the pH of the solution to between about 7.8 and about 9.1. The etchant is useful in removing a layer of an alloy of titanium and tungsten or a layer of tungsten from a precision surface.

Process of etching a titanium/tungsten surface and etchant used therein

Sealing a via using a soventless, low viscosity, high temperature stable polymer or a high solids content polymer solution of low viscosity, where the polymeric material is impregnated within the via at an elevated temperature. A supply chamber is introduced to administer the polymeric material at an elevated temperature, typically at a temperature high enough to liquefy the polymeric material. The polymeric material is introduced through heated supply lines under force from a pump, piston, or a vacuum held within said supply chamber.

Materials and method to seal vias in silicon substrates

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Poughkeepsie, NY, United States of America

Anurag Jain