Teknologian Tutkimuskeskus Vtt Oy

Antti Lamminen

Vladimir Ermolov

Jussi Säily

Mikko Varonen

Tauno Vähä-Heikkilä

Jouko Aurinsalo

Pekka Rantakari

Jussi SÄILY

The present invention relates to a millimeter wave RF antenna array apparatus. The apparatus comprises a single-chip MMIC comprising active circuit elements of the antenna array apparatus. The active circuit elements comprise at least antenna feed circuitry configured to feed antenna elements of the antenna array. The apparatus comprises an interposer fabricated of low-loss RF material, such as glass, low-temperature co-fired ceramic, LTCC, or printed circuit board, PCB. The interposer comprises transmission lines of a RF distribution network and a plurality of antenna elements of the antenna array. The transmission lines of the interposer are coupled to the MMIC for providing RF connections for distributing RF signals to and from the antenna feed circuitry. Area of the interposer that comprises the transmission lines of the RF distribution network and the plurality of antenna elements is collocated with the area of the MMIC that comprises said antenna feed circuitry.

Millimeter-wave antenna array apparatus

According to an example aspect of the present invention, there is provided an apparatus for an antenna, comprising, a first power amplifier and a second power amplifier and a common ground between the first power amplifier and the second power amplifier, wherein a Radio Frequency, RF, output of the first power amplifier is coupled to the common ground and a RF output of the second power amplifier is coupled to the common ground.

Power amplifier for an antenna

A hybrid millimeter-wave Wilkinson divider comprises an input port (), a first output port (), a second output port (), and transmission lines connecting the input port () to the first and second output ports () implemented by transmission lines in a carrier substrate (PCB,). An isolation resistor of the Wilkinson divider connected between the first and second output ports () is integrated in a monolithic micro-wave integrated circuit (MMIC) chip () installed on the carrier substrate. On the MMIC chip the isolation resistor is connected between RF input metal pads. A compensation circuit for parasitic capacitances caused by the RF input metal pads is provided on the MMIC chip () so that the on-chip resistor appears as a pure resistance to the output ports () of the Wilkinson divider on the carrier substrate (PCB,).

Wilkinson divider

According to an example aspect of the present invention, there is provided an antenna array for a transmit-array antenna system with a fixed feed antenna, comprising an inner radiating surface for receiving a first signal from the fixed feed antenna, an outer radiating surface for emitting a second signal from the antenna array and a platform for electric connection of Radio Frequency, RF, components disposed between the inner and outer radiating surfaces, the platform having a phase shifter for operatively connecting the inner and outer radiating surfaces.

Phased array antenna system with a fixed feed antenna

A probe apparatus of a millimeter or submillimeter radio frequency band comprises transition layers having outermost layers on opposite surfaces of the probe apparatus. An internal transition cavity extends through the transition layers for guiding electromagnetic radiation within the probe apparatus. A probe layer disposed between the transition layers, the probe layer having a lateral transmission line for interacting with the electromagnetic radiation guided by the internal transmission cavity.

Probe apparatus

According to an example aspect of the present invention, there is provided antenna array comprising: a plurality of parallel antenna elements arranged on a printed circuit board laminate comprising a flexible substrate layer on a rigid substrate layer comprising portions specific to one or more antenna elements, said flexible substrate layer comprising a feed network, wherein the rigid substrate layer is configured movable between a first arrangement of the portions of the rigid substrate layer, where the antenna array has a planar form, and a second arrangement of the portions of the rigid substrate layer, where the antenna array is curved around one or more axes.

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Espoo, Finland

Antti Lamminen