Sika Technology Ag

Antonio Voci

Michael Gutgsell

Urs Burckhardt

Andreas Kramer

Jan Olaf Schulenburg

Urs Rheinegger

Noah Munzinger

Dusko Paripovic

Dominique Gallo

Christian Eyholzer

Carl Philipp Rosenau

Sara Haltiner

A method of bonding two shaped bodies Sand Sincluding the steps of: a) providing shaped body S; b) arranging shaped body Swherein shaped body S, forming cavity between two shaped bodies, c) introducing one-component thermosetting epoxy resin compositions into cavity, wherein one-component thermosetting epoxy resin composition is one-component thermosetting epoxy resin composition including: at least one epoxy resin A having average of more than one epoxy group per molecule; at least one curing agent B for epoxy resins activated by elevated temperature; at least one polyester polyol PP obtainable by reaction of at least one diol having structure HO&#x2014;(CH)&#x2014;OH the value of x'=2-10, and &#x2014;at least one dicarboxylic acid having structure HOOC&#x2014;(CH)&#x2014;COOH and derivatives of dicarboxylic acid, value of y&#x2032;=8-18, and wherein proportion of polyester polyol PP is 1.5% to 20% by weight, based on total weight of one-component thermosetting epoxy resin composition.

Method for connecting molded bodies by injecting a single-component heat-curing epoxy resin composition into cavities

A heat-curing epoxy resin compositions which can in particular be used as bodyshell adhesives for motor vehicle construction. The heat-curing epoxy resin compositions contain a curing agent which can be activated through elevated temperature and has a first component Kcontaining at least one epoxy resin and a second component Kcontaining at least one tertiary amine and also a primary amine. These compositions, after short-term heating of 30 to 120 seconds at a temperature of 90&#xb0; C. to 130&#xb0; C., exhibit sufficient strength and adhesion to withstand transport-induced mechanical strains.

Heat-curing epoxy resin adhesives

A single-component thermosetting epoxy resin adhesives, including: a) at least one epoxy resin having, on average, more than one epoxy group per molecule; b) at least one latent hardener for epoxy resins; and c) 2-7 wt % aerogel particles, relative to the total weight of the single-component thermosetting epoxy resin adhesive, wherein the epoxy resin adhesive has a viscosity of 1000-4000 Pas, in particular 1000-3500 Pas, at 25&#xb0; C., wherein the viscosity is oscillographically determined by means of a rheometer having a heatable plate (MCR 301, AntonPaar) (gap 1000 &#x3bc;m, measurement plate diameter: 25 mm (plate/plate), deformation 0.01 at 5 Hz, temperature: 25&#xb0; C.). The epoxy resin adhesives are characterized in that they can be easily applied in the temperature range from 40&#xb0; C. to 70&#xb0; C. and are scouring-resistant, even at higher temperatures.

Single-component thermosetting epoxy resin having high scouring resistance

The present invention relates to heat-curing sealant compositions including at least epoxy resin, dicyanodiamide or an amine complex of a Lewis acid, polyurethane polymer (PUP) containing isocyanate groups and polyaldimine. These single component sealant compositions are characterized by a rapid skin formation and high tensile strength. Because of the short skin formation time, said compositions are optimally suitable for use as sealants in autobody work because they can be excellently layered on top of same.

Heat-curing sealant compositions having fast skin formation and high tensile strength

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Zurich, Switzerland

Antonio Voci