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Consiglio Nazionale Delle Ricerche

Esaote S.p.a.

Antonio Minotti

Massimo Pappalardo

Giosuè Caliano

Alessandro Caronti

Vittorio Foglietti

Elena Cianci

Alessandro Nencioni

The invention concerns a manufacturing process, and the related micromachined capacitive ultra-acoustic transducer, that uses commercial silicon waferalready covered on at least one or, more preferably, on both faces by an upper layerand by a lower layer' of silicon nitride deposited with low pressure chemical vapour deposition technique, or deposition LPCVD deposition. One of the two layersor&#x2032; of silicon nitride, of optimal quality, covering the waferis used as emitting membrane of the transducer. As a consequence, the micro-cell arrayforming the CMUT transducer is grown onto one of the two layers of silicon nitride, i.e. it is grown at the back of the transducer with a sequence of steps that is reversed with respect to the classical technology.

Surface micromechanical process for manufacturing micromachined capacitive ultra-acoustic transducers and relevant micromachined capacitive ultra-acoustic transducer

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Rome, Italy

Antonio Minotti