Utac Headquarters Pte. Ltd.

United Test and Assembly Center Limited

Antonio Jr B Dimaano

Nathapong Suthiwongsunthorn

Kian Teng Eng

Chuen Khiang Wang

Catherine Bee Liang Ng

Richard Te Gan

Kriangsak Sae Le

A device is disclosed. The device includes a carrier substrate having first and second major surfaces. The first surface includes a die region and contact pads and the second surface includes package contacts. The carrier substrate includes a patterned lead frame which defines a line level with conductive traces and a via level with via contacts. The patterned lead frame provides interconnections between the contact pads and package contacts. The carrier substrate further includes a dielectric layer isolating the conductive traces and via contacts. The device includes a die mounted on the die region of the first surface.

Semiconductor packages and methods of packaging semiconductor devices

Growing community of inventors

Singapore, Singapore

Antonio Jr B Dimaano