Epcos Ag

Tdk Corporation

Anton Leidl

Wolfgang Pahl

Gregor Feiertag

Werner Ruile

Hans Krueger

Pirmin Hermann Otto Rombach

Alois Stelzl

Christian Siegel

Ulrich Wolff

Stefan Seitz

Gino Rocca

Ulrich Knauer

Armin Schober

Jan Tue Ravnkilde

Kurt Rasmussen

Gerd Scholl

Jürgen Portmann

Markus Hauser

Wolfgang Sauer

Matthias Jungkunz

Thomas Baier

Günter Kovacs

Christian Math

Waldemar Gawlik

Dennis Mortensen

Klaus Mayer

Ulrike Roesler

Ulrike Rösler

Marcel Giesen

Morten Ginnerup

Ansgar Schäufele

Ivan Riis Nielsen

Pirmin Rombach

Karl Nicolaus

Clemens Ruppel

Gerd Riha

Evelyn Riha

Matthias Winter

Andreas Beer

Stefan Stufler

Lijun Peng

Robert Eichinger

Thomas Wassner

Thomas Sedlmeier

Technologies are provided for microelectromechanical microphones that can be robust to substantial pressure changes in the environment in which the micromechanical microphones operate. In some embodiments, a microelectromechanical microphone device can include a rigid plate defining multiple openings that permit passage of a pressure wave. The microelectromechanical microphone device also includes a stiffener member integrated into the rigid plate. The stiffener member causes stress to be distributed within the rigid plate in response to the pressure wave inducing deformation of the rigid plate.

Microelectromechanical microphone having a robust backplate

A MEMS device is disclosed. In an embodiment a MEMS device includes a substrate having an active region and at least one integrated electrical and mechanical connection element configured to electrically and mechanically mount the MEMS device to a carrier, wherein the connection element comprises a stress-reducing structure.

MEMS device stress-reducing structure

A MEMS device having a sensor system that is resiliently mounted on a carrier by means of spring elements. The air gap between sensor system and carrier is reduced by a damping structure present on one of facing surfaces of sensor system and carrier. The spring elements are at least partially accommodated within recesses of the damping structure. The height of the air gap is small enough to allow squeeze film damping.

Resiliently mounted sensor system with damping

An integrated circuit, a circuit assembly and a method for operation the integrated circuit are disclosed. In embodiments an integrated circuit includes at least one supply voltage terminal configured to receive a supply voltage for operation of the integrated circuit, at least one input terminal configured to receive an analog input signal corresponding to an audio signal, at least one output terminal configured to provide an analog output signal, a signal strength detector configured to detect a signal strength of the analog input signal provided at the at least one input terminal and a signaling circuit configured to indicate an amplification setting of the integrated circuit at the at least one output terminal, wherein the integrated circuit is configured to amplify the audio signal based on the detected signal strength and to output a corresponding amplified signal at the at least one output terminal.

Integrated circuit, circuit assembly and a method for its operation

An integrated circuit, a circuit assembly and a method for operation the integrated circuit are disclosed. In embodiments the integrated circuit includes at least one supply voltage terminal configured to receive a supply voltage for operation the integrated circuit, at least one input terminal configured to receive an analog input signal corresponding to an audio signal, at least one output terminal configured to provide an analog output signal and a signal strength detector configured to detect a signal strength of the analog input signal provided at the at least one input terminal, wherein the integrated circuit is configured to amplify an audio signal based on the detected signal strength and to output a corresponding amplified signal at the at least one output terminal, wherein the integrated circuit comprises a signaling circuit configured to indicate an amplification setting of the integrated circuit at the at least one supply voltage terminal.

A microphone and a method for operating a Microphone are disclosed. In an embodiment the microphone includes a transducer and a mode controller. The microphone has a normal operating mode (M) and a collapse mode (M). The mode controller switches to the collapse mode (M) when an output signal of the transducer reaches or exceeds a predefined threshold value and switches to the normal operating mode (M) when the output signal reaches or falls below a predefined further threshold value (S).

Microphone and method of operating a microphone

A top-port MEMS-microphone has an upper side and a bottom side. The microphone includes a MEMS chip with a monolithically connected protection element at the upper side, a backplate, and a membrane. The microphone also includes a sound inlet at the upper side and a mechanical or electrical connection at the bottom side.

Top-port MEMS microphone and method of manufacturing the same

The present invention relates to a method for producing a sensor (SEN), comprising the steps of arranging a sensor element (SE) on a carrier (TR), arranging a cover (AF) on the sensor element (SE), wherein the sensor element (SE) is enclosed between the cover (AF) and the carrier (TR), adhesively bonding a carrier film (TF) onto the cover (AF), and producing an opening (SO) in the carrier film (TF) and the cover (AF), wherein the openings (SO) in the carrier film (TF) and the cover (AF) at least partly overlap.

Method for producing a sensor

Sensor module, comprising a carrier, at least one sensor chip and at least one evaluation chip which is electrically coupled to the sensor chip. The carrier has a cutout, in which the sensor chip is at least partly situated. The evaluation chip is arranged on the carrier and at least partly covers the cutout.

Sensor module and method for producing sensor modules

The invention relates to a miniaturized electrical component comprising an MEMS chip and an ASIC chip. The MEMS chip and the ASIC chip are disposed on top of each other; an internal mounting of MEMS chip and ASIC chip is connected to external electrical terminals of the electrical component by means of vias through the MEMS chip or the ASIC chip.

Miniaturized electrical component comprising an MEMS and an ASIC and production method

The invention relates to a method for producing a microphone, in which a transducer element (WE) is mounted on a carrier (TR); a cover is arranged over the transducer element (WE) and the carrier (TR) such that the transducer element (WE) is enclosed between the cover and the carrier (TR); a first sound inlet opening (S) is produced in the carrier (TR); a functional test of the microphone is carried out; the first sound inlet opening (S) is closed; and a second sound inlet opening (S) is created in the cover. The present invention further relates to a microphone resulting from the method, in which the first sound inlet opening (S) is prepared but closed.

MEMS microphone and method for producing the MEMS microphone

A method of manufacturing a microphone comprising a substrate, a transducer element that is mounted on a top side of the substrate, a covering layer that covers the transducer element and forms a seal with the top side of the substrate, a shaped covering material that covers the substrate, the transducer element and the covering layer, and a sound opening that extends through the covering material and the covering layer. Methods for manufacturing a microphone and for manufacturing a plurality of microphones are also disclosed.

Method of manufacturing a microphone

A MEMS component includes a substrate in which at least one cavity is present. The cavity is closed off toward an active side of the substrate. An inactive side is arranged opposite the active side of the substrate, and the substrate is covered with a covering film on the inactive side.

MEMS component, method for producing a MEMS component, and method for handling a MEMS component

A component () is proposed wherein the suspension of the component () is effected in a stress-reduced manner. The component () can rest on a membrane () or be held by a spring element (). The membrane () or the spring element () is situated above a depression () or an opening () partially spanned by the membrane (). Preferably, the membrane () has a modulus of elasticity that is less than or equal to the modulus of elasticity of the component () or of the substrate (). The component () can be covered with metal electrodes () wholly or partially over the area on two sides.

Component having stress-reduced mounting

A MEMS microphone having an improved noise performance due to reduced DC leakage current is provided. For that, a minimum distance between a signal line of the MEMS microphone and other conducting structures is maintained. Further, a DC guard structure fencing at least a section of the signal line is provided.

MEMS-microphone

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Hohenbrunn, Germany

Anton Leidl