Robert Boschgmbh

Antoine Puygranier

Johannes Classen

Guenther-Nino-Carlo Ullrich

Denis Gugel

Markus Linck-Lescanne

Ralf Reichenbach

Sebastian Guenther

Timm Hoehr

Jochen Reinmuth

Christoph Schelling

Mirko Hattass

Jens Frey

A micromechanical sensor, including: a substrate; a movable mass element sensitive in three spatial directions; two x-lateral electrodes for detecting a lateral x-deflection of the movable mass element; two y-lateral electrodes for detecting a lateral y-deflection of the movable mass element; z-electrodes for detecting a z-deflection of the movable mass element; each lateral electrode being fastened on the substrate with the aid of a fastening element; the fastening elements of all electrodes being formed close to a connection element of the movable mass element to the substrate.

Micromechanical sensor and method for manufacturing a micromechanical sensor

A micromechanical structure for an acceleration sensor includes a movable seismic mass including electrodes, the seismic mass being attached to a substrate with the aid of an attachment element; first fixed counter electrodes attached to a first carrier plate; and second fixed counter electrodes attached to a second carrier plate, where the counter electrodes, together with the electrodes, are situated nested in one another in a sensing plane of the micromechanical structure, and where the carrier plates are situated nested in one another in a plane below the sensing plane, each being attached to a central area of the substrate with the aid of an attachment element.

Micromechanical structure for an acceleration sensor

A micromechanical z-acceleration sensor, including a seismic mass element including a torsion spring; the torsion spring including an anchor element, with the aid of which the torsion spring is connected to a substrate; the torsion spring being connected at both ends to the seismic mass element with the aid of a bar-shaped connecting element designed as normal with respect to the torsion spring in the plane of the seismic mass element.

Micromechanical z-acceleration sensor

Measures are described which contribute simply and reliably to the mechanical decoupling of a MEMS functional element from the structure of a MEMS element. The MEMS element includes at least one deflectable functional element, which is implemented in a layered structure on a MEMS substrate, so that a space exists between the layered structure and the MEMS substrate, at least in the area of the functional element. According to the invention, a stress decoupling structure is formed in the MEMS substrate in the form of a blind hole-like trench structure, which is open to the space between the layered structure and the MEMS substrate and extends into the MEMS substrate to only a predefined depth, so that the rear side of the MEMS substrate is closed, at least in the area of the trench structure.

MEMS element including a stress decoupling structure and a component including such a MEMS element

To implement cavities having different internal pressures in joining two semiconductor elements, at least one of the two element surfaces to be joined is structured, so that at least one circumferential bonding frame area is recessed or elevated in comparison with at least one other circumferential bonding frame area. At least one connecting layer should then be applied to this structured element surface and at least two circumferential bonding frames should be structured out of this connecting layer on different surface levels of the element surface. The topography created in the element surface permits sequential bonding in which multiple cavities between the two elements may be successively hermetically sealed, so that a defined internal pressure prevails in each of the cavities.

Component including two semiconductor elements, between which at least two hermetically sealed cavities are formed and method for establishing a corresponding bonding connection between two semiconductor elements

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Asperg, Germany

Antoine Puygranier