Dell Products Inc.

Anthony W Howard

Isaac Qin Wang

Patrick A Hampton

David William Grunow

David Wheeler Williams

Yonghong Duan

Kened Li-Diaz

Forming a casing of an information handling system using dual area bi-injection, the method including injecting a first material into a mold: i) at first locations of the mold to form a first portion of a casing, and ii) at second locations of the mold to form a second portion of the casing; and injecting a second material into the mold at third locations of the mold to form a third portion of the casing; wherein injection of the first material and the second material into the mold is done concurrently, wherein injection of the first and the second material into the mold forms a first bonding interface and a second bonding interface between the first material and the second material such that the second material is excluded from ingression to the first portion and the second portion of the casing.

Dual area bi-injection molding

An information handling system may be implemented as a notebook, comprising a first assembly, a second assembly, a hinge mechanically coupling the first assembly to the second assembly wherein the hinge comprises a surface having an apparent reflectivity of light which is variable from a first location of the surface to a second location of the surface, a source of light configured to project light onto a surface of the hinge, and a sensor configured to detect an intensity of light reflected from the surface of the hinge.

Systems and methods for determining hinge angle position in an information handling system

An information handling system may include a battery, a circuit board, an enclosure, and a control circuit. The circuit board may include at least one electric component, a first electrically conductive pad, and a second electrically conductive pad in proximity to the first electrically conductive pad. The enclosure may be configured to house components of the information handling system including the battery and the circuit board, and the enclosure may include a first member, a second member configured to be mechanically coupled to the first member, and a mechanical component comprising conductive material and configured to electrically short the first electrically conductive pad to the second electrically conductive pad when the first member is mechanically coupled to the second member, and cause electrical isolation of the first electrically conductive pad from the second electrically conductive pad when the first member is mechanically decoupled from the second member. The control circuit may be configured to, when the first electrically conductive pad is shorted to the second electrically conductive pad, cause the at least one electrical component to be electrically coupled to the battery and when the first electrically conductive pad is electrically isolated from the second electrically conductive pad, cause the at least one electrical component to be electrically decoupled from the battery.

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Austin, TX, United States of America

Anthony W Howard