Wolfson Microelectronics Limited

Cirrus Logic Inc.

Optoscribe Limited

Intel Corporation

Cirrus Logic International Semiconductor Limited

Anthony Traynor

Richard Ian Laming

Tsjerk Hans Hoekstra

Nicholas D Psaila

Graeme Brown

Paul Mitchell

Mark Hesketh

Mark Begbie

Rowan Pocock

Colin Robert Jenkins

John Macdonald

An optical apparatus () for routing an optical signal () comprises a body () comprising a material. A waveguide () is formed in the body () by laser modification of the material. The optical apparatus () further comprises a region () comprising a lower refractive index than the material of the body () and defines an interface () between the region () and the waveguide (). The waveguide () and the interface () are aligned relative to each other for routing the optical signal () therebetween and reflecting the optical signal () at the interface ().

Optical apparatus, optical assembly and methods of manufacture thereof

Optical apparatus and methods of manufacture thereof An optical apparatus () for evanescently coupling an optical signal across an (interface () is described. The optical apparatus () comprises a first substrate () and a second substrate (). The optical signal is evanescently coupled between a first waveguide () formed by laser inscription of the first substrate () and a second waveguide () of the second substrate (). The first waveguide () comprises a curved section () configured to provide evanescent coupling of the optical signal between the first and second waveguides () via the interface ().

Optical apparatus and methods of manufacture thereof

An optical apparatusfor evanescently coupling an optical signal across an interfaceis described. The optical apparatuscomprises a first substrateand a second substrate. The optical signal is evanescently coupled between a first waveguideformed by laser inscription of the first substrateand a second waveguideof the second substrate. The first waveguidecomprises a curved sectionconfigured to provide evanescent coupling of the optical signal between the first and second waveguidesvia the interface

A method of fabricating a micro-electrical-mechanical system (MEMS) transducer comprises the steps of forming a membrane on a substrate, and forming a back-volume in the substrate. The step of forming a back-volume in the substrate comprises the steps of forming a first back-volume portion and a second back-volume portion, the first back-volume portion being separated from the second back-volume portion by a step in a sidewall of the back-volume. The cross-sectional area of the second back-volume portion can be made greater than the cross-sectional area of the membrane, thereby enabling the back-volume to be increased without being constrained by the cross-sectional area of the membrane. The back-volume may comprise a third back-volume portion. The third back-volume portion enables the effective diameter of the membrane to be formed more accurately.

MEMS process and device

A method of fabricating a micro-electrical-mechanical system (MEMS) transducer comprises the steps of forming a membrane () on a substrate (), and forming a back-volume in the substrate. The step of forming a back-volume in the substrate comprises the steps of forming a first back-volume portion () and a second back-volume portion (), the first back-volume portion () being separated from the second back-volume portion () by a step in a sidewall of the back-volume. The cross-sectional area of the second back-volume portion () can be made greater than the cross-sectional area of the membrane (), thereby enabling the back-volume to be increased without being constrained by the cross-sectional area of the membrane (). The back-volume may comprise a third back-volume portion. The third back-volume portion enables the effective diameter of the membrane to be formed more accurately.

A method of fabricating a micro-electrical-mechanical system (MEMS) apparatus on a substrate () comprises the steps of processing the substrate () so as to fabricate an electronic circuit (); depositing a first electrode () that is operably coupled with the electronic circuit (); depositing a membrane () so that it is mechanically coupled to the first electrode (); applying a sacrificial layer (); depositing a structural layer () and a second electrode () that is operably coupled with the electronic circuit () so that the sacrificial layer () is disposed between the membrane () and the structural layer () so as to form a preliminary structure; singulating the substrate (); and removing the sacrificial layer () so as to form a MEMS structure, in which the step of singulating the substrate () is carried out before the step of removing the sacrificial layer ().

MEMS device

A MEMS device comprises a membrane layer and a back-plate layer formed over the membrane layer. The membrane layer comprises an outer portion and an inner portion raised relative to the outer portion and a sidewall for connecting the inner portion and the outer portion. The sidewall is non-orthogonal to the outer portion.

MEMS device with reduced stress in the membrane and manufacturing method

A MEMS device comprising a flexible membrane that is free to move in response to pressure differences generated by sound waves. A first electrode mechanically coupled to the flexible membrane, and together form a first capacitive plate. A second electrode mechanically coupled to a generally rigid structural layer or back-plate, which together form a second capacitive plate. A back-volume is provided below the membrane. A first cavity located directly below the membrane. Interposed between the first and second electrodes is a second cavity. A plurality of bleed holes connected the first cavity and the second cavity. Acoustic holes are arranged in the back-plate so as to allow free movement of air molecules, such that the sound waves can enter the second cavity. The first and second cavities in association with the back-volume allow the membrane to move in response to the sound waves entering via the acoustic holes in the back-plate.

A MEMS device comprising a flexible membrane that is free to move in response to pressure differences generated by sound waves. A first electrode mechanically coupled to the flexible membrane, and together form a first capacitive plate. A second electrode mechanically coupled to a generally rigid structural layer or back-plate, which together form a second capacitive plate. A back-volume is provided below the membrane. A first cavity located directly below the membrane. Interposed between the first and second electrodes is a second cavity. A plurality of bleed holes connect the first cavity and the second cavity. Acoustic holes are arranged in the back-plate so as to allow free movement of air molecules, such that the sound waves can enter the second cavity. The first and second cavities in association with the back-volume allow the membrane to move in response to the sound waves entering via the acoustic holes in the back-plate.

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Livingston, United Kingdom

Anthony Traynor