Other

Corning Incorporated

Picosys Incorporated

Anthony Thomas Chobot

Raymond Miller Karam

Thomas M Wynne

Georges Roussos

Raymond M Karam, Ii

Georges Russos

A flow cell incorporates a first substrate with a metal layer on one surface. A tape layer having flow channels is adhered to the first substrate. A second substrate having a second metal layer on one surface is adhered to the tape layer opposite the first substrate. At least one of the first and second metal layers includes mating cutouts to at least partially expose the flow channels.

Method and apparatus for taped interlayer flow cell with masking

Embodiments generally relate to chips containing one or more hermetically sealed chambers that may be dismantled under controlled conditions using a release technique. In one embodiment a chip comprises a first hermetic seal bonding first and second elements to create a first chamber and a second hermetic seal bonding third and fourth elements to create a second chamber encompassing the first chamber. The first hermetic seal may be broken open independently of the second hermetic seal by the application of a mechanical or thermal technique.

Chips with hermetically sealed but openable chambers

Embodiments generally relate to apparatus and methods for dismantling a hermetically sealed chamber. In one embodiment, an apparatus facilitating the opening of a hermetically sealed chamber in a device comprises a fixture configured to hold the device, and a system configured to create sufficient tensile or shear stress at a bond interface of the seal to open the seal under controlled conditions. In one embodiment, a method for opening a hermetic seal between first and second elements forming a chamber in a microfluidic chip comprises using a release technique creating sufficient tensile or shear stress at a bond interface of the seal to open the seal under controlled conditions. The release technique comprises introducing a tool to the vicinity of the interface without any contact between the tool and any material within the chamber. The breaking of the seal results in the complete separation of the first and second elements.

Methods to dismantle hermetically sealed chambers

Method and apparatus for taped interlayer flow cell with masking and conductive traces

Embodiments generally relate to methods for forming and dismantling a hermetically sealed chamber. In one embodiment, the method comprises using room temperature laser bonding to create a hermetic seal between a first element and a second element to form a chamber. A bond interface of the hermetic seal is configured to allow the hermetic seal to be opened under controlled conditions using a release technique. In one embodiment, the chamber is formed within a microfluidic chip and the chamber is configured to hold a fluid. In one embodiment a chip comprises a first hermetic seal bonding first and second elements to create a first chamber and a second hermetic seal bonding third and fourth elements to create a second chamber encompassing the first chamber. The first hermetic seal may be broken open independently of the second hermetic seal by the application of a mechanical or thermal technique.

Growing community of inventors

Goleta, CA, United States of America

Anthony Thomas Chobot