Vlsi Technology, Inc.

The University of Texas System

Anthony Sayka

Allen Page

Patricia A Vargas

Pierre Leroux

Stacy W Hall

Edward R Vokoun, Iii

Bryan D Schmidt

Judy U Galloway

Dhiraj Sardar

Daniel D Siems

Danine Villarreal

Gerardo F Martinez

Robert J Rocks

Mohammad A Siddiqui

Frederick J Barrera

Bradley G Williams

Raylon M Yow

Christopher D Reynes

Henry B Taylor, Iii

The present invention provides a method of cleaning a wafer. The method comprises suspending the wafer beneath a vacuum chuck. The vacuum chuck contains an acoustic wave emitter. The acoustic wave emitter is positioned within the vacuum chuck to prevent the acoustic wave emitter from contacting the surface of the wafer. The method further comprises applying acoustic waves to the wafer.

Apparatus and method for cleaning a wafer

A coating apparatus for detecting the presence of contaminants carried by a liquid a is that is applied as a coating on a workpiece. A tube guides the liquid along a flow path to the workpiece. A light source illuminates the liquid along the flow path with an optical fiber or other light carrier, and light is scattered by any contaminants present in the liquid. Light scattered by the contaminant particles is more intense than light scattered by the other liquid particles, and this brighter scattered light is detected by a light detector positioned adjacent to the fluid flow path. The coating system is particularly well suited for use in a spin-on coating process that applies a liquid, such as a photoresist material or a dielectric material, to a semiconductor wafer or other workpiece that is secured to a rotating turntable and rotated to receive a coating of the liquid.

Apparatus for coating a workpiece with fluid contamination detection

A liquid level monitor uses a tube to confine a float to a vertical path with a canister containing a lower liquid and an upper liquid which meet at a liquid boundary, the level of which is to be monitored. Light from a light-emitting diode is conveyed to a vertical position of the tube by an optical fiber. A second optical fiber is arranged in a diametrically opposed position of the tube to detect light transmitted across the tube from the first optical fiber. The float is more transmissive than either liquid. When the level of the boundary falls to the level of the optical fibers, received light increases. The second optical fiber conveys this return light to a photodetector, the output of which can be used to trigger an alarm indicating that the boundary level is low.

Optical-fiber liquid-level monitor

A collision avoidance technique is provided in an automated semiconductor wafer processing system, wherein a magnet or magnetic strip is incorporated into each boat or carrier used to hold and transport the semiconductor wafers during the IC fabrication process. Additionally, a magnetic field sensing device is incorporated into the robotic arm of the system for sensing the presence of magnetic fields generated by the magnet(s) incorporated into the boats and/or carriers. Using this system, it is possible for the automated system controller to determine whether an imminent collision is about to occur by monitoring changes in the detected magnetic field. In this way, collisions between one boat/carrier and a second boat/carrier may be anticipated and avoided without relying upon physical contact between the two objects in order to detect collision.

Magnetic sensing robotics for automated semiconductor wafer processing

An integrated circuit system includes an integrated circuit with a heat sink assembly including a fusible core. In the event that power dissipation by the integrated circuit threatens to exceed its safe operating range, the fusible core melts, absorbing the heat of fusion and delaying further temperature increases. A motor is repeatedly activated to attempt to rotate a shaft within the fusible core. When the core is solid, the shaft cannot be turned, but once it melts the shaft turns. The shafts motion is detected and used to trigger a reduction in the drive clock frequency of the integrated circuit. This reduces power consumption and dissipation until the integrated circuit cools and the heat sink core solidifies.

Fusion heat sink for integrated circuit

A coating method for detecting the presence of contaminants carried by a liquid that is applied as a coating on a workpiece. A tube guides the liquid along a flow path to the workpiece. A light source illuminates the liquid along the flow path with an optical fiber or other light carrier, and light is scattered by any contaminants present in the liquid. Light scattered by the contaminant particles is more intense than light scattered by the other liquid particles, and this brighter scattered light is detected by a light detector positioned adjacent to the fluid flow path. The coating system is particularly well suited for use in a spin-on coating process that applies a liquid, such as a photoresist material or a dielectric material, to a semiconductor wafer or other workpiece that is secured to a rotating turntable and rotated to receive a coating of the liquid.

Method for detecting contaminants carried by a fluid

A coating system for detecting the presence of contaminants carried by a fluid that is applied as a coating on a workpiece. A tube guides the fluid along a flow path to the workpiece. A light source illuminates the fluid along at least a portion of the flow path, and this light is scattered by any contaminants present in the fluid. Light scattered by the contaminant particles is more intense than light scattered by the other fluid particles, and this brighter scattered light is detected by a light detector positioned adjacent to the fluid flow path. If one or more contaminant particles is detected in the fluid, a warning signal can be given and/or the flow of fluid can be stopped. This coating system is particularly well suited for use in a spin-on coating process that applies a liquid, such as a photoresist material or a dielectric material, to a semiconductor wafer or other workpiece that is secured to a rotating turntable.

Apparatus and method for detecting contaminants carried by a fluid

In the fabrication of an integrated circuit, an intermetal dielectric is formed using a plural plasma processes that can be performed without having to transfer the wafer in the interim. This saves on wafer handling. A wafer with a patterned first metal wafer is placed into a plasma chamber. A relatively low-power noble gas plasma is applied to clean the wafer. A reactive plasma treatment is then used to deposit silicon dioxide to a thickness greater than ultimately desired. A noble gas plasma is used to etch back the silicon dioxide. Spin-on glass is then applied. The previous etch back aids the conformance of the spin-on glass to the underlying structure. The spin-on glass can be polished for further planarization. A second silicon dioxide layer can be deposited on top of the spin-on glass. Via apertures can be photolithographically defined through the three-layer dielectric. Finally, second layer metal is deposited and patterned. The method provides for high wafer throughput, while minimizing voids at the interface between the spin-on glass and the underlying silicon dioxide layer.

Metal interconnect fabrication with dual plasma silicon dioxide

Method and apparatus for detecting the presence of selected types of defects, such as chemical stains from a liquid photoresist material or a liquid dielectric material, on a non-visible chosen surface of a semiconductor water that has undergone at least one processing step. In one embodiment, a support substrate for, the wafer is provided that has a highly reflecting surface adjacent to the chosen surface. The reflecting surface and the chosen surface are moved apart, and the chosen surface is illuminated with light to form an optical image of the chosen surface. The optical image of the chosen surface is reflected in the reflecting surface, and the reflected optical image is examined for the presence of selected types of defects. In another embodiment, a portion of this reflecting surface is initially contiguous to the chosen surface. A selected defect, if any, on the chosen surface changes a surface characteristic of the reflecting surface so that the presence of this defect on the chosen surface is visually perceptible on the reflecting surface.

Semiconductor wafer defect monitoring

A plastic-encapsulated integrated circuit includes a package formed of plastic, an integrated circuit embedded in the package, and heat-dissipating means for conducting heat from the integrated circuit, which means include a hermetically sealed container formed of a heat conductive material embedded in the package and extending from the integrated circuit to at least an outer surface of the package, and a volatile fluid disposed in the container. In operation, the volatile fluid absorbs heat from the integrated circuit when it changes from the liquid state to the vapor state, and dissipates heat when it changes from the vapor state to the liquid state.

Integrated circuit package including a heat pipe

A method for detecting bubbles in a liquid characterized by the steps of: a) flowing a liquid through a chamber; b) allowing bubbles in the liquid to escape within the chamber; and c) sensing the gaseous volume within the chamber to determine whether any gas bubbles were present in the liquid. An apparatus of the present invention includes a sealed chamber, a pump for pumping a liquid through the sealed chamber, and a mechanism for detecting gaseous accumulation within the chamber. The mechanism for detecting gaseous accumulation preferably includes a floating device having a float portion and a magnet portion, and a magnetic detector for detecting the magnetic field strength generated by the magnet portion. The magnetic field strength can be used to calculate the liquid level within the chamber which can, in turn, used to calculate the gaseous volume within the chamber. An analyzer coupled to the magnetic detector may produce a detection signal when the gaseous volume exceeds a predetermined criteria to alarm an operator that excessive amount of bubbles are present in the liquid.

Contaminant monitor for a flowing liquid

Method and apparatus for monitoring the fluid spray pattern of fluid sprayed by a nozzle onto a semiconductor wafer during processing of the wafer. A light source is positioned to illuminate the fluid sprayed in a pattern P from the nozzle, and one or more photodetectors are positioned to receive light scattered by the fluid spray. Each photodetector develops an electrical signal in response to receipt of the scattered light, and these electrical signals are received and analyzed by a comparison means. One or more reference signals representing a desired fluid spray pattern P.sub.0 is stored in the comparison means, and each electrical signal for the pattern P is compared with the corresponding reference signal for the pattern P.sub.0 by the comparison means. If one or more signal for the pattern P differs substantially from the corresponding reference signal for the desired pattern P.sub.0, an alarm may be generated and/or delivery of fluid by the nozzle may be terminated.

Electro-optic monitor for fluid spray pattern

A photolithographic process involves the use of plasma to effect a superficial etch of a semiconductor wafer prior to the application of photoresist. Photoresist is applied directly on the wafer, without using an adhesion promotor. The photoresist is then exposed to patterned light. After exposure, the photoresist is developed leaving the desired photoresist mask on the wafer. Due to the superficial etch, curling of the photoresist is minimized, enhancing the selective protection provided by the photoresist to the wafer below.

Semiconductor photolithography with superficial plasma etch

Integrated circuits include a silicon substrate having multiple conductive metallization lines placed thereon and vertically spaced apart from each other by polyimide insulating layers wherein a moisture resistant barrier layer is completely interposed between the polyimide layers and each metallization line. The moisture resistant barrier retards corrosion of the metallization lines by reaction products formed by the release of water from the polyimide layer by reducing the amount of water which can penetrate to the metallization lines.

Growing community of inventors

San Antonio, TX, United States of America

Anthony Sayka