Minnesota Mining and Manufacturing Company

3m Innovative Properties Company

Anthony R Plepys

Larry D Boardman

Jason D Clapper

Neeraj Sharma

David James Yarusso

Richard B Ross

Eumi Pyun

Randolph D Schueller

Richard E Bennett

Robert L Smith

Harold W Leverty

Howard Edwin Evans

Dennis Edward Vogel

William H Moser

Thu-Van T Tran

Vivek Bharti

Daniel C Munson

Timothy D Bredahl

Paul Marian Harvey

John D Geissinger

Marie Aloshyna Ep Lesuffleur

Haohao Lin

Tabitha A Clem

Peter J Harrison

Naiyong Jing

A halogen-free flame retardant adhesive comprises an acrylic copolymer preparable by polymerization of monomers comprising a first monomer which comprises a low glass transition temperature (Tg) monomer, a second monomer which comprises a high Tg monomer, wherein at least one of the first and second monomers comprises a (meth)acrylate, and a phosphinate containing monomer.

Halogen-free flame retardant pressure sensitive adhesive and tape

Flame retardant tackifiers are represented by the formula ' wherein R represents a hydrocarbyl group having 20 carbons and three consecutive fused six-membered rings; and each Rindependently represents an alkyl group having from 1 to 8 carbon atoms. Curable compositions contain a curable binder precursor and at least one of the flame resistant tackifiers. Pressure-sensitive adhesives comprises an elastomer and at least one flame retardant tackifier compound represented by the formula &#x2033; wherein R represents a hydrocarbyl group having 20 carbon atoms and three consecutive fused six-membered rings and each Rindependently represents an alkyl or aryl group having from 1 to 8 carbon atoms. 

Flame retardant, pressure-sensitive adhesive, and curable composition

A low-cost integrated circuit package is provided for packaging integrated circuits. In preferred embodiments, the package comprises a flexible circuit that is laminated to a stiffener using a dielectric adhesive, with the conductive traces on the flexible circuit facing toward the stiffener but separated therefrom by the adhesive. The conductive traces include an array of flip-chip attachment pads. A window is formed in the stiffener over the attachment pad array, such as by etching. The adhesive is then removed over the attachment pads by laser ablation, but left in place between the pads, thus forming a flip-chip attachment site. In preferred embodiments, this invention eliminates the need for high-resolution patterned adhesive, and it also eliminates the need for application of a solder mask at the flip-chip attachment site, because the remaining adhesive performs the solder mask function of preventing bridging between attachment pads. This package provides a die attachment site having a high degree of planarity due to tensile stresses formed in the flexible circuit and adhesive layers during lamination of those layers to the stiffener. Embodiments of this invention may be used with TBGA, frangible lead, and other packaging technologies.

Laminated integrated circuit package

A ball grid array (BGA) package is provided in which the stiffener of the BGA may also be utilized as a conductive layer. A TAB tape is adhered to the stiffener by an adhesive and both the TAB tape and the adhesive may have vias which open to the stiffener. Conductive plugs which may be formed of solder paste, conductive adhesives, or the like may then be filled in the vias to provide electrical connection from the TAB tape to the stiffener. The vias may be located adjacent to solder ball locations. The TAB tape may include multiple conductor layers or multiple layers of single conductive layer TAB tape may be stacked upon each other to provide additional circuit routing. Further, the TAB tape layers may also be combined with the use of metal foil layers.

Multi-layer interconnect sutructure for ball grid arrays

A tape ball grid array package reverses the usual attachment of flexible circuitry to a stiffener so that the circuit traces face the stiffener rather than away from the stiffener as is conventional. This construction allows the elimination of a previously necessary solder mask and so reduces the cost to produce the package.

Wire bond tape ball grid array package

A solvent-free hot melt process, for preparing a non-thermosettable, pressure-sensitive adhesive from a tackified non-thermoplastic hydrocarbon elastomer. The process employs a continuous compounding device that has a sequence of alternating conveying and processing zones. The processing zones masticate and mix materials in them. Non-thermoplastic elastomers having high molecular weight may be readily compounded into adhesives in the process.

Solventless compounding and coating of non-thermoplastic hydrocarbon

Growing community of inventors

Austin, TX, United States of America

Anthony R Plepys