Advanced Micro Devices Corporation

Anthony P Coniglio

Richard J Bartlett

Khoi A Phan

Martin Mazur

Jeffrey P Erhardt

Jerry Cheng

Wolfram Grundke

Daniel E Sutton

Carol M Bradway

David A Steele

A remote track editor system, method, and computer readable medium is provided to remotely edit track flows and recipes of semiconductor processing tools. The editor system includes a processing track, a track controller, and a remote track editor for remotely editing recipes of at least one semiconductor processing tool. The editor system communicates with remote terminals and accesses multiple flows and recipes stored on network databases through a SECS/GEM interface. The remote track editor edits recipes without interrupting the process track and correctly renumbers line and flow numbers of the recipes when editing, deleting, or inserting steps. The remote track editor also performs side-by-side comparisons of multiple recipes, verifies the contents of recipes to master recipes, and provides indicators of mismatches.

Remote wafer flow and recipe editor for simiconductor processing control

Methods and systems are disclosed for reducing resist residue defects in a semiconductor manufacturing process. The methods comprise appropriate adjustment of hardware, substrate, resist, developer, and process variables in order to remove resist residues from a semiconductor substrate structure in order to reduce resist residue defects therein, including special vapor prime and development operations.

Methods and systems for controlling resist residue defects at gate layer in a semiconductor device manufacturing process

Methods and systems are disclosed for reducing resist residue defects in a semiconductor manufacturing process. The methods comprise appropriate adjustment of hardware, substrate, resist, developer, and process variables in order to remove resist residues from a semiconductor substrate structure in order to reduce resist residue defects therein. The method may comprise employing an anti reflective coating prior to applying a photo resist coating in a semiconductor manufacturing process. Also disclosed are methodologies for exhausting resist residue during development via a rinsing fluid.

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San Jose, CA, United States of America

Anthony P Coniglio