Westinghouse Electric Corporation

Anthony P Barrett

Wei-Fang A Su

Karl F Schoch, Jr

Luciano C Scala

Resin compositions comprising 20 to 50% by weight, based on total composition weight, of a first resin which comprises an acrylate-epoxy oligomer having a molecular weight of from 2000 to 5000; from 2 to 10% of a second resin which comprises an acrylate-urethane oligomer; up to 50% of a third resin which comprises a second acrylate-epoxy oligomer, where from 1 to 5% of the epoxy is an epoxy novolac; from 10 to 40% of a liquid acrylate; from 2 to 20% of a liquid diacrylate having an ether linkage; from 5 to 25% of a liquid alkylene diacrylate; and from 1 to 5% of a UV photoinitiator. The compositions also preferably includes from 0.05 to 1% of a flow control agent. The compositions are applied to substrates such as printed wiring boards and cured with ultraviolet light to form a conformal coating on the substrate.

UV conformal coatings

A UV curable electrically conductive adhesive has been developed with low resistivity, adequate lap shear strength, good thermal stability, and very stable conductivity at high temperatures of about 100.degree. C. and high humidity. The adhesive may be applied by silk screen printing and cured by UV in about 8 seconds. The adhesive may also be used as a replacement of solder in automated surface mount technology for electronic circuit fabrication. The adhesive is a mixture of (A) a blend of an acrylate epoxy and a urethane, a copolymer of an acrylate epoxy and a urethane, or mixtures thereof; (B) a polyfunctional acrylate monomer; (C) a photoinitiator, and (D) a conductive filler. Optionally, adhesion promoters and flow control agents may be used.

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Munhall, PA, United States of America

Anthony P Barrett