Cisco Technology, Inc.

Apple Inc.

Anthony Nguyen

Norman Tang

David Lai

Liang Ping Peng

Kevin Scott Fetterman

Michelle Rae Goldberg

Laura M DeForest

Stephen Vincent Jayanathan

Nick Peng

Rico L Zorkendorfer

D Brice Achkir

Michael Kai Morishita

Marco Mazzini

Steven Alf Hanssen

David Phillip Tarkington

James M Cuseo

Joshua Ryan Funamara

Peter N Jezoirek

Jose Carlos Raygoza Echeagaray

An optics module sends, to a host module, a pin signal indicating that an optics module is plugged into the host module, wherein the optics module is configured to operate at at least a first data rate and a second data rate. The optics module receives, from the host module, an indication of a host data rate. The optics module determines whether there is clock and data recovery loss of lock between the first data rate and a host data rate. If it is determined that there is clock and data recovery loss of lock between the first data rate and the host data rate, the optics module initializes at the second data rate if the second data rate matches the host data rate.

Multi-identity optics modules

Examples of computing devices and assemblies for mounting computer components to an enclosure or other structure of the computing device are described. In some examples, the mounting assembly may include a compliant member having a plurality of corner portions configured to engage the corners of the component. The mounting assembly may also include a bracket configured to enclose at least a portion of the compliant member. The mounting bracket may be configured to mount the component at an angle relative to the enclosure or other structure, and may include one or more features adapted for improved cooling of the component mounted therein. The compliant member may include a plurality of ribs or other retaining elements for maintaining the component in a spaced apart position relative to the mounting bracket.

Internal computer assembly features and methods

A dual rate transceiver may be provided. First, a host data speed of a host device may be detected. Then a last know data speed of a transceiver may be determined. Next, it may be determined that the host data speed and the last know data speed are different. And in response to determining that the host data speed and the last know data speed are different, the transceiver may be reconfigured to operate at the host data speed.

Dual rate transceiver

Bandwidth translation may be provided. First, data may be transceived at a first data port. Next, the data may be transceived at a plurality of second data ports. The bandwidth of a path for the data between the first port and the plurality of second ports may be translated.

xQSFP+ host cable to upgrade xSFP+ based products

Connectors having a slim profile and that may be used for hard-disk drives and other devices. One example may provide a connector that provides a route path including a 180-degree turn while maintaining a slim profile. Another example may provide a connector having a slim profile that is easily manufactured.

Slim-profile hard-disk drive connector

Techniques are provided for sending and receiving data communications across management data channels. The techniques comprise a quad small form-factor pluggable (QSFP) transceiver module configured to send and receive a plurality of data signals, a plurality of enhanced small form-factor pluggable (SFP+) transceiver cage devices, and a plurality of management cables. Each of the SFP+ transceiver cage devices is configured to interface with an SFP+ transceiver module. Each of the management cables is configured to interface with the QSFP transceiver module and corresponding ones of the SFP+ transceiver cage devices. Furthermore, each of the management cables operates as a data channel to manage data flow between the QSFP transceiver module and the corresponding ones of the SFP+ transceiver cage devices.

QSFP to SFP+ adapter cable

A system, method and apparatus is provided for optimizing network data communications. At an extender device, a data signal is received at a host link port across a data cable that is interfaced with the host link port. The host link port is configured to receive the data signal. The data cable is configured to carry management communications and data communications between a switch host device and the extender unit device. The data signal is split into data signal components. Each of the data signal components comprises a ten gigabit per second portion of the data signal. The data signal components are sent to one or more network devices via one or more corresponding data transmission ports.

Low latency NX10G form factor module to an enhanced small form-factor pluggable uplink extender to maximize host port density

A Quad Small Form-Factor Pluggable (QSFP) transceiver module is provided that is configured to interface with a QSFP host and to send and receive a plurality of data signals at a data rate of up to forty gigabits per second (40 G). A plurality of 10GBase-T ports with Registered Jack (RJ) 45 connectors is also provided, wherein each of the 10GBase-T ports is configured to interface with a 10GBase-T device to send and receive a plurality of data signals at a data rate of ten gigabits per second (10 G). Cables are configured to interface with the QSFP transceiver module and with corresponding ones of the 10GBase-T ports with the RJ45 connectors. Each of the plurality of cables operates as a data channel for data flow between the QSFP transceiver module and the corresponding ones of the 10GBase-T ports with the RJ45 connectors.

QSFP to 4x10GBASE-T converter cable assembly

Techniques are provided for sending and receiving data communications between an enhanced Quad Small Form-Factor Pluggable (QSFP+) transceiver module and an enhanced Small Form-Factor Pluggable (SFP+) transceiver module. An adapter device is provided that has a first set of signal pins configured to interface with an SFP+ transceiver module and a second set of signal pins is provided that is configured to interface with a QSFP+ host port. A retimer unit is also provided that is configured to modify a 10G signal of a first electrical signal standard associated with the SFP+ transceiver module to a 10G signal of a second electrical standard associated with a QSFP+ transceiver module and to enhance a 10G signal of the second electrical signal standard to a 10G signal of the first electrical signal standard.

QSFP+ to SFP+ form-factor adapter with signal conditioning

Electronic devices may be provided with conductive structures such as displays and conductive housing walls. Conductive gaskets may be used to form electrical paths between opposing conductive structures in an electronic device. The conductive gaskets may be formed from conductive sheets of material such as conductive fabric sheets. The conductive fabric or other conductive sheets may form conductive gasket wall structures that extend around air-filled cavities in the conductive gaskets. A conductive gasket may have an elongated shape such as a tubular shape that is characterized by a longitudinal axis. The longitudinal axis may follow a straight path or a curved path. To facilitate bending of a hollow conductive gasket to follow a curved path, the wall structures of the gasket may be provided with openings. Cables may be held in place using flaps of gasket wall material and may run through interior portions of a hollow gasket.

Hollow conductive gaskets with curves and openings

Computing devices and microphone assemblies including acoustic waveguides are described. According to some examples, a computing device may include an enclosure, a microphone which may be spaced apart and angled relative to the interior surface of the enclosure to which the microphone may be coupled. The computing device may further include an acoustic waveguide disposed between the microphone and the interior surface of the enclosure, the acoustic waveguide having a passage for allowing acoustic energy to be transmitted from a microphone opening in the enclosure to the receiving element of the microphone (also referred to as sensing element, or microphone sensor).

Acoustic waveguide and computing devices using same

Techniques are provided describing a first connector unit that receives first data from a first transceiver and a second connector unit that receives second data from a second transceiver. A switch unit is configured to receive first switch data from the first connector unit at a first data rate and second switch data from the second connector unit at the first data rate. A third connector unit receives the first switch or the second switch data from the switch unit and a second portion of the second data from the second connector unit. The third connector unit also sends the first switch data to a host port when the first connector unit receives the first data and to send the second switch data and the second portion of the second data to the host port when the second connector unit receives the second data.

Two-in-one CFP form-factor pluggable adapter

An adapter device is provided that is configured to interface with a host device according to a first communication standard via a first connector and with a transceiver module according to a second communication standard via a second connector. The adapter device detects that the transceiver module has connected to the adapter device. The adapter device retrieves transceiver module identifier information from the transceiver module and converts the transceiver module identifier information to the first communication standard. The converted transceiver module identifier information and adapter device identifier information are sent to the host device.

Method for emulating communication standards of transceiver modules for native host devices

Techniques are provided for resetting a microprocessor-based subcomponent of a pluggable module. Specifically, a host device connected to the pluggable module determines that the microprocessor-based subcomponent needs to be reset. The host device resets the microprocessor-based subcomponent without the need for a module level reset of the pluggable module.

Growing community of inventors

San Jose, CA, United States of America

Anthony Nguyen