Micron Technology Incorporated

Anthony M Geidl

Dale Herber Hiscock

Markus H Geiger

John H Gentry

Michael Roth

Michael J Scott

Greg S Gatlin

Evan C Pearson

Lael H Matthews

Dennis G Montierth

Mow Yiak Goh

Garth N Grubb

Wesley W Borie

An exemplary memory includes a first sub-wordline (SWL) driver configured to provide first data from a memory cell array, a second SWL driver configured to provide second data from a memory cell array, and an input/output (I/O) circuit configured to receive the first data and the second data from the first and second SWL drivers, respectively. The I/O circuit including a data terminal mapping circuit configured to selectively route the first data and the second data to different respective data terminal based on a data terminal mapping setting.

Apparatuses and methods to perform DQ swapping on memory

Memory devices and systems with post-packaging master die selection, and associated methods, are disclosed herein. In one embodiment, a memory device includes a plurality of memory dies. Each memory die of the plurality includes a command/address decoder. The command/address decoders are configured to receive command and address signals from external contacts of the memory device. The command/address decoders are also configured, when enabled, to decode the command and address signals and transmit the decoded command and address signals to every other memory die of the plurality. Each memory die further includes circuitry configured to enable, or disable, or both individual command/address decoders of the plurality of memory dies. In some embodiments, the circuitry can enable a command/address decoder of a memory die of the plurality after the plurality of memory dies are packaged into a memory device.

Memory with post-packaging master die selection

Memory devices and systems with adjustable through-silicon via (TSV) delay, and associated methods, are disclosed herein. In one embodiment, an apparatus includes a plurality of memory dies and a TSV configured to transmit signals to or receive signals from the plurality of memory dies. The apparatus further includes circuitry coupled to the TSV and configured to introduce propagation delay onto signals transmitted to or received from the TSV. In some embodiments, the apparatus includes additional circuitry configured to activate, deactivate, adjust at least a portion of the circuitry, or any combination thereof, to alter the propagation delay. In this manner, the apparatus can align internal timings of memory dies of the plurality of memory dies.

Memory with adjustable TSV delay

Memory devices and systems with TSV health monitor circuitry, and associated methods, are disclosed herein. In one embodiment, a memory device includes a plurality of memory dies, a plurality of through-silicon vias (TSVs) in electrical communication with the memory dies; and circuitry. In some embodiments, the circuitry is configured to electrically couple a pair of TSVs of the plurality of TSVs to form a passive circuit. For example, the circuitry can activate a transistor electrically positioned between TSVs of the pair of TSVs to electrically couple the pair of TSVs. In these and other embodiments, the circuitry applies a test voltage to the pair of TSVs using the passive circuit to determine whether a TSV of the pair of TSVs includes degradation.

Memory with TSV health monitor circuitry

Growing community of inventors

Boise, ID, United States of America

Anthony M Geidl