Hewlett-packard Development Company, L.P.

Anthony M Fuller

Michael W Cumbie

Peter Mardilovich

Qingqiao Wei

Chien-Hua Chen

James Michael Gardner

Rio Rivas

Scott A Linn

Bradley D Chung

Garrett E Clark

Ed Friesen

Ozgur E Yildirim

Bhavin Shah

Donald W Schulte

Terry E McMahon

Galen P Cook

Stanley J Wang

Kellie Susanne Jensen

Christopher A Leonard

Irina Nikolaevna Milonova

Adam L Ghozeil

Lawrence H White

Sterling Chaffins

Chantelle Domingue

David C Kamp

Terry Mcmahon

Valerie J Marty

Amy Gault

Huyen Pham

Conrad Jenssen

Michael H Hayes

Zhen Yi Li

Daren L Forrest

Michael Groom

James Micheal Gardner

Chantelle Elizabeth Domingue

Terry Mcmahon Mcmahon

Stan E Leigh Leigh

Aspects of the present disclosure are directed to an apparatus including a circuit region and a fluidic region. In a particular example, the circuit region with logical circuits thereon, includes a thermal oxide layer on a silicon substrate, and a dielectric layer over the field oxide layer, the dielectric layer including a doped dielectric film. The microfluidic device further includes a fluidic region including fluid ports formed through a surface of the apparatus and including an un-doped dielectric film. The fluidic region includes an aperture in the dielectric layer, where the aperture is defined by a dielectric wall which forms part of the dielectric layer. A sealing film deposited over the dielectric wall may prevent the doped dielectric film from contacting fluid contained in the fluid port.

Corrosion tolerant micro-electromechanical fluid ejection device

In various examples, a fluid ejection device may include a fluid ejection die formed with a first material and that includes a bondpad and a plurality of fluid ejectors, and a cover layer adjacent the fluid ejection die. The cover may be formed with a second material that is different than the first material and may include a first region that overlays the bondpad and a second region that overlays the plurality of fluid ejectors. In various examples, the first and second regions are separated by a break in the cover layer. The break may be filled with a third material that is different than one or both of the first and second material.

Fluid ejection device with break(s) in cover layer

A method includes applying a mold chase to a fluid ejection die to at least partially define at least one cavity. The mold chase includes a feature to contact a fluid ejection portion of the fluid ejection die, and at least one structure separate from the feature to contact a first end portion adjacent a first end of the fluid ejection die. The method includes filling the at least one cavity with a mold compound to produce a molded carrier for the fluid ejection die.

Applying mold chase structure to end portion of fluid ejection die

A microfluidic device including a fluid ejection channel defined by a fluid barrier and an orifice, or nozzle, for containing and/or passing fluids, and further including micro-electromechanical systems (MEMS) and/or electronic circuitry may be fabricated on a silicon substrate and included in a fluid ejection system. Various microfabrication techniques used for fabricating semiconductor devices may be used to manufacture such microfluidic devices.

A circuit die may include an outermost circuit layer having electrical transmission routing and an alignment target overlying the outermost circuit layer.

Circuit die alignment target

A die for a printhead is described herein. The die includes a number of fluid feed holes disposed in a line parallel to a longitudinal axis of the die, wherein the fluid feed holes are formed through a substrate of the die. The die includes a number of fluidic actuators, proximate to the fluid feed holes, to eject fluid received from the fluid feed holes. Circuitry on the die operates the fluidic actuators, wherein traces are provided in layers between adjacent fluid feed holes, connecting circuitry on each side of the fluid feed holes.

Die for a printhead

A device includes a first column of contact pads. The device also includes a column of fluid actuation devices disposed longitudinally to the first column of contact pads.

Fluid ejection devices including contact pads

A device includes a plurality of fluid ejection dies, wherein each of the fluid ejection dies includes a contact pad and a plurality of fluid actuation devices. The device includes an electrical interconnect element in contact with the contact pad of each of the fluid ejection dies to electrically interconnect the plurality of fluid ejection dies.

Fluid ejection devices including electrical interconnect elements for fluid ejection dies

A die for a printhead is described herein. The die includes a number of fluid feed holes disposed in a line parallel to a longitudinal axis of the die, wherein the fluid feed holes are formed through a substrate of the die. A number of fluidic actuators are proximate to the fluid feed holes to eject fluid received from the plurality of fluid feed holes. The die includes logic circuitry to operate the fluidic actuators, wherein the logic circuitry is disposed on a first side of the plurality of fluid feed holes. Power circuitry to power the plurality of fluidic actuators is disposed on an opposite side of the fluid feed holes from the logic circuitry. Activation traces are disposed between each of the fluid feed holes to couple the logic circuitry to the power circuitry.

A fluid ejection device includes a fluid ejection die including a first end portion positioned adjacent a first end of the fluid ejection die, and a fluid ejection portion positioned adjacent the first end portion. The fluid ejection die includes a contact pad positioned in the first end portion, and a fluid actuation device positioned in the fluid ejection portion. A carrier is attached to the fluid ejection die. The carrier includes a slot to provide fluid to the fluid actuation device. The slot extends longitudinally along the fluid ejection portion to a first slot end. A length from the first slot end to the first end of the fluid ejection die is less than 1.5 mm.

Fluid ejection device with a carrier having a slot

A die for a printhead is described herein. The die includes a number of fluid feed holes disposed in a line parallel to a longitudinal axis of the die. A number of fluidic actuators are disposed in a line parallel to the fluid feed holes. A crack detector trace is routed between each of the plurality of fluid feed holes.

A die for a printhead is described herein. The die includes fluid feed holes disposed in a line parallel to a longitudinal axis of the die. The fluid feed holes are formed through a substrate of the die. Fluidic actuators are proximate to the fluid feed holes, to eject fluid received from the fluid feed holes. Field-effect transistors are parallel to the fluid feed holes. Each fluidic actuator is powered by an associated field effect transistor. Logic circuitry to actuate the field-effect transistors is disposed on an opposite side of the fluid feed holes from the field-effect transistors. Traces, disposed between the fluid feed holes, electrically couple the logic circuitry to the field-effect transistors. The die has a repeating structure including one fluid feed hole, two fluidic actuators, and two field-effect transistors placed at an interval of two times a dot pitch in a line along the die.

Examples include a fluid die embedded in a molded panel. The fluid die includes a substrate, and the substrate includes a first surface. The molded panel surrounding sides of the fluid die such that the first surface is disposed below a top surface of the molded panel. A raised contact formation is disposed on the substrate to extend at least up to the top surface of the molded panel.

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Corvallis, OR, United States of America

Anthony M Fuller