Medtronic, Inc.

Anthony M Chasensky

Eric H Bonde

John E Kast

Erik R Scott

Phillip C Falkner

Randy S Roles

Xuan K Wei

Brad Conrad Tischendorf

Christian S Nielsen

Craig L Schmidt

Gordon Orvis Munns

Bernard Q Li

Thomas P Miltich

Chris J Paidosh

Joseph J Viavattine

Reginald D Robinson

Prabhakar A Tamirisa

Markus W Reiterer

Richard T Stone

Gabriela C Molnar

Michael Jay Ebert

Todd V Smith

Shawn C Kelley

Timothy J Denison

David A Dinsmoor

Duane L Bourget

Joel A Anderson

Forrest C M Pape

Stephen J Roddy

Steven T Deininger

Jeffrey J Clayton

Michael J Baade

Timothy T Bomstad

Markus W Réitérer

A neuromodulation therapy is delivered via at least one electrode implanted subcutaneously and superficially to a fascia layer superficial to a nerve of a patient. In one example, an implantable medical device is deployed along a superficial surface of a deep fascia tissue layer superficial to a nerve of a patient. Electrical stimulation energy is delivered to the nerve through the deep fascia tissue layer via implantable medical device electrodes.

Minimally invasive implantable neurostimulation system

Implantable medical devices include circuitry positioned adjacent to header-related structures, rather than having the header and related structures sitting atop the position of the circuitry within a device housing. A circuit board within the device housing may be positioned adjacently to a lead bore of the header. Feedthrough conductors may extend from the circuitry to conductors of the header while being positioned adjacently to the circuit board. Lead frame conductors may extend to the electrical connectors of the lead bores while also being adjacent to the upper portion of the circuitry. Device height may be reduced by having the circuitry be positioned adjacent to one or more of the various header-related structures.

Implantable medical devices having circuitry located adjacent to header-related structures

A medical device system for delivering a neuromodulation therapy includes a delivery tool for deploying an implantable medical device at a neuromodulation therapy site. The implantable medical device includes a housing, an electronic circuit within the housing, and an electrical lead comprising a lead body extending between a proximal end coupled to the housing and a distal end extending away from the housing and at least one electrode carried by the lead body. The delivery tool includes a first cavity for receiving the housing and a second cavity for receiving the lead. The first cavity and the second cavity are in direct communication for receiving and deploying the housing and the lead coupled to the housing concomitantly as a single unit.

An implantable medical device (IMD) has a housing enclosing an electronic circuit. The housing includes a first housing portion, a second housing portion and a joint coupling the first housing portion to the second housing portion. A polymer seal is positioned in the joint in various embodiments. Other embodiments of an IMD housing are disclosed.

An implantable medical device (IMD) has a housing enclosing an electronic circuit. The housing includes a first housing portion, a second housing portion and a joint coupling the first housing portion to the second housing portion. A polymer enclosure member surrounds the joint and circumscribes the housing in various embodiments. Other embodiments of an IMD housing are disclosed.

A cold weld is formed in a multilayer-material. A first pin is coupled to a first block. A second pin is coupled to a second block. The multilayer material is disposed between the first pin and the second pin. The first pin opposes the second pin. The multilayer material is held in the XY plane and floats in the Z axis.

Cold weld

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Saint Paul, MN, United States of America

Anthony M Chasensky