Amkor Technology, Inc.

Anthony LoBianco

Frank Joseph Juskey

Thomas P Glenn

Vincent DiCaprio

Ronald James Schoonejongen

Jonathon Greenwood

Stephen Gregory Shermer

A simple, inexpensive method and apparatus are provided for increasing the thickness of a body molded on a semiconductor package without the need for a new mold, or for reworking the parts of an existing mold. The method includes providing a mold having parts that engage each other at respective interfacial surfaces, and a shim having a selected thickness and an opening through an interior portion thereof. The shim is interposed between the interfacial surfaces of the mold parts such that the mold parts are spaced apart by the thickness of the shim, and such that the mold parts and the shim opening define a cavity in the mold. The length and width of the cavity of the mold thus remain the same, while the height of the cavity, and hence, the thickness of the molded body, is increased by the thickness of the shim.

Method and apparatus for increasing thickness of molded body on semiconductor package

A method for overmolding a ceramic substrate for a semiconductor chip or other electrical device, and a resulting package, are disclosed. In one embodiment, plural ceramic substrate panels having a matrix of semiconductor chips thereon are precisely located on and attached to a temporary support member using an alignment tool. The member and the attached ceramic substrate panels are then placed in a mold tool. When the mold tool is closed, it clamps down on the member around the ceramic substrate panel, and not on the ceramic substrate panel itself. A mold compound injected into the mold tool encapsulates the chips and ceramic substrate panels. Subsequently, packages each containing a chip are singulated from the encapsulated ceramic substrate panels.

Method for molding semiconductor package having a ceramic substrate

This invention provides a method for making a semiconductor package with stacked dies that substantially reduces risk of fracturing of the dies and prevents breakage of the wire bonds caused by wire sweep. One embodiment of the method includes the provision of a substrate and a pair of semiconductor dies, each having opposite top and bottom surfaces and a plurality of wire bonding pads around the peripheries of their respective top surfaces. One die is attached and wire bonded to a top surface of the substrate. A measured quantity of an uncured, fluid adhesive is dispensed onto the top surface of the first die, and the adhesive is squeezed out to the edges of the dies by pressing the bottom surface of the second die down onto the adhesive until the two dies are separated by a layer of the adhesive. The adhesive is cured and the second die is wire bonded to the substrate. A bead of an adhesive is dispensed around the periphery of the dies such that it covers the wire bonds and bonding pads on the second die. A plastic body is molded over the dies and the bead of adhesive. The bead of adhesive prevents bending or breakage of the wire bonds caused by wire sweep during the subsequent molding operation.

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Chandler, AZ, United States of America

Anthony LoBianco