Taiwan Semiconductor Manufacturing Comp. Ltd.

Anthony Lin

Tze-Liang Lee

Pei-Ren Jeng

Ching-Lun Lai

A semiconductor fabrication apparatus includes a processing chamber; a wafer stage configured in the processing chamber; and a chemical delivery mechanism configured in the processing chamber to provide a chemical to a reaction zone in the processing chamber. The chemical delivery mechanism includes an edge chemical injector, a first radial chemical injector, and a second radial chemical injector configured on three sides of the reaction zone.

Apparatus and method for spatial atomic layer deposition

A semiconductor fabrication apparatus includes a processing chamber; a wafer stage configured in the processing chamber; a first chemical delivery mechanism configured in the processing chamber to provide a first chemical to a first reaction zone in the processing chamber; and air edge mechanisms configured on both sides of the first reaction zone to isolate the first reaction zone from other reaction zones in the processing chamber.

A semiconductor fabrication apparatus includes a processing chamber, a wafer stage configured in the processing chamber, a first chemical delivery mechanism configured in the processing chamber to provide a first chemical to a first reaction zone in the processing chamber, and a second chemical delivery mechanism configured in the processing chamber to provide a second chemical to a second reaction zone in the processing chamber. The second chemical delivery mechanism includes an edge chemical injector and a first radial chemical injector both configured to deliver the second chemical to the second reaction zone.

The present disclosure provides a semiconductor fabrication apparatus in accordance with one embodiment. The apparatus includes a processing chamber; a wafer stage configured in the processing chamber, the wafer stage is operable to secure and rotate a plurality of wafers around an axis; a first chemical delivery mechanism configured in the processing chamber to provide a first chemical to a first reaction zone in the processing chamber; and a second chemical delivery mechanism configured in the processing chamber to provide a second chemical to a second reaction zone in the processing chamber. The second chemical delivery mechanism includes an edge chemical injector and a first radial chemical injector.

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Hsin-Chu, Taiwan

Anthony Lin