Skyworks Solutions, Inc.

Anthony James Lobianco

Hoang Mong Nguyen

Howard E Chen

Matthew Sean Read

Dinhphuoc Vu Hoang

Guohao Zhang

George Khoury

Darren Roger Frenette

Gregory Edward Babcock

Robert Francis Darveaux

Lori Ann DeOrio

Robert W Warren

Yi Liu

Leslie Paul Wallis

Anil K Agarwal

Thomas E Noll

René Rodríguez

Qing Gan

Shaul Branchevsky

Luis Eduardo Herrera

Sergio Joaquin Gonzalez Flores

Heliodoro Osuna

William John Domino

David Scott Whitefield

Stephane Richard Marie Wloczysiak

Bipul Agarwal

Hardik Bhupendra Modi

Yasser Khairat Soliman

Bhuvaneshwaran Vijayakumar

Steve Xin Liang

Ki Wook Lee

René Rodriguez

David Steven Ripley

Philip John Lehtola

Weimin Sun

Hong Shen

Peter J Zampardi

Stephen Joseph Kovacic

Hongxiao Shao

Foad Arfaei Malekzadeh

Hsiang-Chih Sun

Sandra Louise Petty-Weeks

Jens Albrecht Riege

Matthew Ozalas

Tin Myint Ko

Patrick Lawrence Welch

Mark A Kuhlman

Yifan Guo

Mehran Janani

Dinphuoc V Hoang

Matthew Thomas Ozalas

In some embodiments, a method for manufacturing packaged radio-frequency devices includes: providing a packaging substrate configured to receive a plurality of components, including a first side and a second side; mounting a first component on the first side of the packaging substrate; implementing a first overmold structure on the first side of the packaging substrate, substantially encapsulating the first component; mounting a second component on the second side of the packaging substrate, the second component being located in an area of the second side where one or more redundant pins, a redundant ground pad, or a redundant portion of a ground pad may be located; implementing a set of through-mold connections on the second side of the packaging substrate, the set of through-mold connections including signal pins and ground pins; and implementing a second overmold structure substantially encapsulating one or more of the component or the set of through-mold connections.

Methods related to dual-sided module with land-grid array (LGA) footprint

An electronic package is provided. The electronic package comprises a substrate having a first side and a second side, the substrate configured to receive one or more electronic components; a first electronic component mounted to the first side of the substrate; a first mold structure extending over at least part of the first side of the substrate; a group of through-mold connections provided on the first side of the substrate, the through-mold connections substantially formed of non-reflowable electrically conductive material; the first mold structure substantially encapsulating the group of through-mold connections; the group of through-mold connections exposed through the first mold structure. An electronic device comprising such an electronic package is also provided. A method of manufacturing such an electronic package is also provided.

Electronic package and method for manufacturing an electronic package

A packaged semiconductor module comprises a substrate having a ground plane, an electronic device mounted on a surface of the substrate, a bond pad disposed on the surface of the substrate and electrically connected to the ground plane, a mold compound covering the electronic device, a conductive post disposed on a side of the electronic device, the conductive post extending from the bond pad and at least partially through the mold compound, and a conductive layer disposed on the mold compound and electrically coupled to the conductive post and to the ground plane, the conductive post, the conductive layer, and the ground plane together forming the integrated electromagnetic interference shield, the conductive post extending from the bond pad to the conductive layer in a direction perpendicular to a plane defined by the surface of the substrate.

Application of conductive via or trench for intra module EMI shielding

Devices and methods related to metallization of ceramic substrates for shielding applications. In some embodiments, a ceramic assembly includes a plurality of layers, the assembly including a boundary between a first region and a second region, the assembly further including a selected layer having a plurality of conductive features along the boundary, each conductive feature extending into the first region and the second region such that when the first region and the second region are separated to form their respective side walls, each side wall includes exposed portions of the conductive features capable of forming electrical connection with a conductive shielding layer.

Devices and methods related to metallization of ceramic substrates for shielding applications

Aspects of this disclosure relate to methods of selectively shielded radio frequency modules. A radio frequency module can be provided with a radio frequency component and an antenna. A shielding layer can be formed over a portion of the radio frequency module such that the radio frequency component is shielded by the shielding layer and the antenna is unshielded by the shielding layer.

Selectively shielded radio frequency modules

A packaging substrate can include a first surface and a second opposing surface, the first surface including a first mounting region of a first electronic module region and the second opposing surface including a first electrical contacts region of the first electronic module region. The packaging substrate can include a saw street region with at least a portion that surrounds the first electronic module region, and a saw street feature formed on the second opposing surface within at least a portion of the saw street region, the saw street feature being a solder mask layer over a metal layer.

Reduction of packaging substrate deformation

A packaged radio-frequency device can include a packaging substrate configured to receive one or more components, the packaging substrate including a first side and a second side. The packaging substrate may include a first component mounted on the first side and a first overmold structure implemented on the first side, the first overmold structure substantially encapsulating the first component. The packaging substrate may further include a set of through-mold connections implemented on the second side of the packaging substrate, the set of through-mold connections including signal pins and ground pins, a second component mounted on the second side of the packaging substrate, the second component being located in an area of the second side configured to implement a redundant ground pad or a redundant portion of a ground pad, and a second overmold structure substantially encapsulating one or more of the second component or the set of through-mold connections.

Devices related to dual-sided module with land-grid array (LGA) footprint

Front end systems and related devices, integrated circuits, modules, and methods are disclosed. One such packaged module includes a multi-mode power amplifier circuit in an interior of a radio frequency shielding structure and an antenna external to the radio frequency shielding structure. The multi-mode power amplifier circuit includes a stacked output stage including a transistor stack of two or more transistors. The multi-mode power amplifier circuit also includes a bias circuit configured to control a bias of at least one transistor of the transistor stack based on a mode of the multi-mode power amplifier circuit. The radio frequency shielding structure can extend above a package substrate. The antenna can be on the package substrate. Other embodiments of front end systems are disclosed, along with related devices, integrated circuits, modules, methods, and components thereof.

Selectively shielded radio frequency module with multi-mode stacked power amplifier stage

Devices for fabrication of shielded modules. In some embodiments, a carrier assembly can be provided for processing of packaged modules. The carrier assembly can include a plate having a first side that defines a plurality of openings, and an adhesive layer implemented on the first side of the plate. The adhesive layer can define a plurality of openings arranged to substantially match the openings of the plate, with each opening of the adhesive layer being dimensioned such that the adhesive layer is capable of providing an adhesive engagement between an underside perimeter portion of a package and a perimeter portion about the corresponding opening of the first side of the plate.

Devices for fabrication of shielded modules

Packaged modules for use in wireless devices are disclosed. A substrate supports integrated circuit die including at least a portion of a baseband system and a front end system, an oscillator assembly, and an antenna. The oscillator assembly includes an enclosure to enclose the oscillator and conductive pillars formed at least partially within a side of the enclosure to conduct signals between the top and bottom surfaces of the oscillator assembly. Components can be vertically integrated to save space and reduce trace length. Vertical integration provides an overhang volume that can include discrete components. Radio frequency shielding and ground planes within the substrate shield the front end system and antenna from radio frequency interference. Stacked filter assemblies include passive surface mount devices to filter radio frequency signals.

Radio frequency modules

A packaging substrate can include a first surface and a second opposing surface, the first surface having a mounting region configured to receive electronic components, and electrical contacts formed on the second opposing surface. A saw street region can surround the mounting region and the electrical contacts, a metal layer and a solder mask layer being formed within the saw street region on the second opposing surface, and the solder mask layer being formed over the metal layer. An electronic module can include a packaging substrate including a first surface and a second opposing surface, the first surface including a mounting region. A plurality of electronic components can be mounted on the mounting region. A ground pad can be formed on the second opposing surface of the packaging substrate, the ground pad including a solder mask layer formed thereon, the solder mask layer having a plurality of openings.

Methods and devices related to reduced packaging substrate deformation

A method for providing electromagnetic shielding of a semiconductor die includes attaching a semiconductor die to a package substrate of a packaged radio frequency module, where the package substrate includes one or more radio frequency circuits fabricated therein. The method also includes encapsulating the semiconductor die with a molding compound. The method also includes at least partially covering the molding compound with an electromagnetic shielding structure having an outer layer including cobalt. A phone board assembly can include the packaged radio frequency module attached to a printed circuit board. The packaged radio frequency module can be incorporated into a mobile device.

Methods for electromagnetic shielding using an outer cobalt layer

Devices and methods related to metallization of ceramic substrates for shielding applications. In some embodiments, a method for fabricating a ceramic device can include forming a plurality of conductive features on or through a selected layer along a boundary between a first region and a second region, each conductive feature extending into the first region and the second region. The method can also include forming an assembly that includes the selected layer and one or more other layers. The method can further include separating the first region and the second region along the boundary such that each of the first region and the second region forms a side wall, the side wall including exposed portions of the conductive features, the exposed portions capable of forming electrical connection with a conductive shielding layer.

Methods related to metallization of ceramic substrates for shielding applications

According to certain aspects, a method for manufacturing packaged radio-frequency (RF) devices can include: providing a packaging substrate configured to receive a plurality of components, the packaging substrate including a first side and a second side; mounting a first circuit on the first side of the packaging substrate; implementing a first overmold structure on the first side of the packaging substrate, the first overmold structure substantially encapsulating the first component; mounting a second component on the second side of the packaging substrate, the second component being located in an area of the second side where redundant ground pins may be located; implementing a set of through-mold connections on the second side of the packaging substrate, the set of through-mold connections including signal pins and ground pins; forming a second overmold structure over the component and the set of through-mold connections; and removing a portion of the second overmold structure.

A method for manufacturing a package with a conformal shield antenna includes forming a mold compound layer, attaching the mold compound layer to a printed circuit board, applying a conformal shield layer on a first surface of the mold compound layer, the mold compound layer disposed between the conformal shield layer and the printed circuit board module, and shaping the conformal shield layer to define a planar antenna structure. Optionally, the method includes forming a cavity in the mold compound layer, applying a cover layer over the cavity to enclose the cavity and hardening the cover layer.

Method of manufacturing a radio-frequency module with a conformal shield antenna

Growing community of inventors

Irvine, CA, United States of America

Anthony James Lobianco