Motorola Corporation

Anthony J Suppelsa

Anthony B Suppelsa

Henry F Liebman

Michael F Shaw

Branko L Avanic

Fadia Nounou

David C Everest, Iii

Hal R Canter

Dale R Adams

Thomas J Swirbel

Dale W Dorinski

Julio A Abdala

Frank J Juskey, Jr

Robert F Darveaux

Thomas A Goodwin

Glenn E Gold

Richard J Kolcz

Richard W Jones

John M Cook

Carl M Thielk

Michael Valdez

Lynne J Giacomino

A substrate,has an electrically adjustable trim pad,on the bottom side. A circuit pattern,resides on the top side, covered by an RF shield,. The trim pad is located on the bottom side directly below the RF shield, and is electrically connected,to the circuit pattern. A number of surface mount connections,, typically C5 solder bumps, are located on the bottom side, and surround the trim pad. The trim pad is trimmed after the RF shield is attached, thus providing more accurate tuning of the circuit on the top side.

Substrate having trim window in a C5 array

An evaporative cooling vessel (100) for controlling the temperature of a predetermined portion of an electronic part during the solder reflow process. The evaporative cooling vessel (100) includes a cavity (105) for holding a fugitive material (107) at the housing (111) of an electronic part to maintain the housing at or below a specified temperature. As heat is applied during solder reflow, the electronic part is subjected to a high temperature capable of allowing solder to melt. Thus, the part housing (111) of the electronic part can be controlled at a substantially lower temperature than the reflow temperature. This allows the evaporative cooling vessel (110) to use the evaporative cooling properties of the fugitive material to prevent damage to the electronic part.

Evaporative cooling vessel for controlling the temperature of a portion

A computer controlled assembly line (10) contains multiple work cells (40) for assembling a printed circuit board (PCB). Each work cell contains a conveyor (30) that can independently adjust its width, and the work cells are arranged to process the printed circuit board within the cell. The work cells are arranged so that they can pass the printed circuit board from the conveyor in one work cell to the conveyor in the next cell. The conveyors have two parallel rails (35, 36) situated so that the distance between the rails can be automatically adjusted to accommodate printed circuit boards of varying widths on the same assembly line at the same time. Each work cell independently adjusts the width of its conveyor (i.e. the distance between the rails) to accommodate the incoming printed circuit board. When the PCB is cleared out of the first cell, a second PCB waiting to enter the first cell is scanned (20), and the conveyor width of the first cell is re-adjusted to accommodate the different size of the first PCB. The entire assembly line is controlled by a central controller, such as a computer.

Method for automatic conveyor width adjustment

A liquid crystal display assembly (10) can function in either a transparent or reflective mode. The assembly consists of a reflective-type liquid crystal display cell (12) placed in front of an electrochromic panel (14). When a display driver (16) activates the electrochromic panel, it absorbs light. When the driver energizes segments (15) of the reflective-type liquid crystal display cell, they become reflective, providing a visual image to an observer. When the electrochromic panel is not activated by the driver, it is transparent or translucent, allowing the observer to see completely through the liquid crystal display assembly.

Transparent or reflective liquid crystal display assembly with

A hazardous gas detection system is integrated into a wireless communication device such as a two-way radio. The radio has housing (102) with an opening (104) for receiving external air. A bellows-like device (114) has a first side (116) which is attached to an audio speaker diaphragm (112) by a rigid interconnect element (126). A fixed second side (118) of the bellows has first and second ports, 120 and 122. Vibrations from the speaker diaphragm are transferred to the bellows, causing the bellows to expand and contract. During bellows expansion, air is sucked into a first port (120) of the bellows. As the bellows contracts, the air is forced out through a second port (122) of the bellows and directed toward a gas sensor (132) mounted on an internal surface (106) of the radio housing. A warning mechanism in communication with the gas sensor provides forewarning of dangerously high gas concentration levels.

Gas detection system for a portable communication

An electrical circuit board (100) includes a substrate (101) on which a metallized bar code pattern (104) is disposed. The substrate (101) further includes an electrical circuit metallization pattern (103) which incorporates at least a portion of the metallized bar code pattern (104).

Electrical circuit board and circuit board assembly

A stencil printing apparatus (100) is provided for printing a solder paste (108), through apertures (104) in a stencil (102), onto metallized portions of a printed circuit substrate (106). The printing apparatus contains a laser surface profiling device (114) which is used to produce 2- and 3-dimensional profiles of a portion of the surface of solder paste adjacent to a squeegee (110). Data is processed and sent to a controller (118) which is coupled to a solder paste dispenser (112). The controller automatically signals the dispenser (112) to dispense additional solder paste at deficient locations as needed.

Apparatus and method for automatic monitoring and control of stencil

system of helically coiled air hoses (18) supports a printed circuit board (14) in an assembly station, and allows the conveyor rails (15, 16) to adjust in and out, accommodating various widths of printed circuit boards (PCB). One of the conveyor rails is fixed and the other is movable. Air hoses are each formed in a helix and placed below the PCB and above the upper work surface of the assembly station, and arranged so that when the air hoses are pressurized the helix expands in diameter to become wedged between the work surface and the PCB to support it from below. One end of each of the air hoses is connected to the fixed rail and the other end is connected to the movable rail. The hoses are sufficiently flexible so as to be free to move about in a lateral direction, but they are diametrically rigid to prevent the diameter of each hose from changing substantially when the hoses are pressurized. The individual coils of the helix can be easily deflected by any protruding components on the bottom side of a printed circuit assembly as it shuttles into the assembly station. When the hoses are pressurized, the coils stiffen to support the PCB from the bottom, substantially preventing deformation of the PCB when a force is exerted upon it from above.

System for supporting a printed circuit board during assembly

A voltage controlled oscillator module (100) (400) provides tuning capability for the VCO in a shielded environment. The module includes a trimmable capacitor (110) (410) having metal plates (112, 114), (412, 414, 416) capacitively coupled through the substrate. One of the metal plates (114) (416) is a trimmable plate which can be trimmed to tune the VCO frequency. The trimmable metal plate (114) (416) remains exposed on the bottom surface (108) (408) of the substrate (104) (404) so that the frequency of the VCO can be tuned while the reminder of the oscillator circuitry (102) (402) on the top surface (106) (406) is encapsulated by a ground shield (116) (418).

Shielded VCO module having trimmable capacitor plate external to shield

A voltage controlled oscillator module assembly (300) minimizes microphonics in a low profile package. Included within the module (300) are a substrate (302), VCO circuitry (308), and a ground shield (314) encapsulating the VCO circuitry. Included within the VCO circuitry (308) is at least one resonator (310) which is solderable on at least two of its surfaces. One surface of the resonator (310) is soldered to the substrate (302) while another surface of the resonator is soldered to the shield (314). An improved ground is thus provided to the resonator (310) which reduces the occurrences of microphonics while providing a low profile package for the module (300).

Voltage controlled oscillator module assembly

A method for controlling the temperature of a predetermined portion of an electronic part during the solder reflow process. The method includes the steps of applying (107) an absorbent material containing a fugitive material (109) to a predetermined portion of an electronic part which must be kept below the solder reflow temperature to prevent damage. Heat is then applied and the electronic part is subjected to a high reflow temperature capable of allowing solder to melt. The predetermined portion of the electronic part is controlled (113) at a substantially lower temperature than the high temperature due to evaporative cooling properties of the fugitive material avoiding damage to the electronic part.

Method of controlling the temperature of a portion of an electronic part

A method of manufacturing a circuit carrying substrate having one or more coaxial via holes. The center core or inner layer (330) of the circuit carrying substrate is a dielectric material that has a plated (339) through hole or via (335) coupling the two surfaces of the inner layer together. One side of the inner layer has a first metallization pattern (336) and the other side has a second metallization pattern (338) on it. The through hole is electrically conductive (339) and connects portions of the first and second metallization patterns. The plated through hole is filled with a dielectric material (340). A first dielectric layer (342) is formed on one side of the inner layer, and a second dielectric layer (344) is formed on the other side of the inner layer, so that the dielectric layers cover the first and second metallization patterns and the filled via hole. A third metallization pattern (350) is formed on the first dielectric layer, and a fourth metallization pattern (360) is formed on the second dielectric layer. A second via hole (370) is formed within the first via hole, substantially concentric to and electrically insulated from the first via hole, to electrically connect the third and fourth metallization patterns.

Method of manufacturing a circuit carrying substrate having coaxial via

A method for attaching a shield (102) to a an electronic assembly (116) having a heat sink (110) includes applying solder on the inner walls (104) of the shield (102). Next, the shield (102) is placed over the electronic assembly (116) such that the electronic assembly (116) is covered by the shield (102) and the shield (102) is in mechanical contact with the heat sink (110). Then, the shield (102) and heat sink (110) are heated so that the solder on the inner walls (104) of shield (102) flows and solders the shield (102) to the heat sink (110).

Method for attaching a shield

An encapsulated electronic component having an integral heat diffuser. The heat producing electronic component (10) is mounted on a substrate carrier (12) and a layer of encapsulant material (16) covers the component. A layer of thermally conductive material (18) is applied over the encapsulant material, and then a second layer of encapsulant material (20) is applied over the thermally conductive material. The heat generated by the component is distributed throughout the thermally conductive material, thereby eliminating the hot spot over the component, resulting in a substantially lower surface temperature.

Encapsulated electronic component having a heat diffusing layer

A self centering coil (200) includes a coil section (202) and also having curved end section (206) and (204) at opposite sides of the coil section (202). The curved end sections are preferably substantially flat and in a plane which is parallel to the center axis (306) of the coiled section (202).

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Coral Springs, FL, United States of America

Anthony J Suppelsa