Hewlett-packard Development Company, L.P.

Anthony J Galvan

Sterling Chaffins

Kristopher J Erickson

Kevin P Dekam

Cory J Ruud

Chris Aschoff

Henry Kang

Jami Ryan Barone

Lawrence Thurber

Kelly B Smith

Ruhua Cai

In an example, a composition for three-dimensional (3D) printing includes a polymer build material and a non-conductive fusing agent dispensable onto the polymer build material to form a polymer-fusing agent composite portion when heated to a sintering temperature, a conductive agent dispensable onto on the polymer build material to form a polymer-conductive agent composite portion when heated at least to the sintering temperature, the conductive agent comprising: at least one conductive particulate present in an amount of from about 10% to about 60% of a total weight of the conductive agent; at least one co-solvent present in an amount of from about 10% to about 50% of a total weight of the conductive agent; and an additive present in an amount of from about 0% to about 10% of a total weight of the conductive agent.

Three-dimensional printing

A method for adhesive stacking includes dispensing a first line of adhesive onto a first substrate; dispensing at least one additional line of adhesive stacked onto the first line of adhesive; and placing a second substrate onto the at least one additional line of adhesive to join the first and second substrates.

Stacked adhesive lines

Growing community of inventors

Corvallis, OR, United States of America

Anthony J Galvan