Texas Instruments Corporation

Anthony DiCarlo

Rabah Mezenner

Richard Lee Knipe

James D Huffman

Patrick Ian Oden

James Carl Baker

David A Rothenbury

Stephen Arion Meisner

Yanghua He

Lisa Ann Wesneski

Mark Andrew Franklin

Jingqiu Chen

George Nicholas Harakas

The present invention provides a method for planarizing a metal layer, and a method for manufacturing a micro pixel array. The method for planarizing the metal layer, without limitation, may include the steps of forming a metal layer over a photoresist layer, and then planarizing the metal layer using a chemical mechanical planarization process.

Method for chemical mechanical planarization of a metal layer located over a photoresist layer and a method for manufacturing a micro pixel array using the same

A field emission devicecomprises an anodeand a cathodeseparated by a distancefrom the anode. At least one of the anode or cathode is configured to move with respect to the other in response to an applied voltageto at least one of the anode and cathode, the distance being adjustable by the movement.

Display using a movable electron field emitter and method of manufacture thereof

A micromirror arrayfabricated on a semiconductor substrate. The arrayis comprised of three operating layers. An addressing layeris fabricated on the substrate. A hinge layeris spaced above the addressing layerby an air gap. A mirror layeris spaced over the hinge layerby a second air gap. The hinge layerhas a hingeunder and attached to the mirror, the hingepermitting the mirrorto tilt. The hinge layerfurther has spring tipsunder the mirror, which are attached to the addressing layer. These spring tipsprovide a stationary landing surface for the mirror

Yokeless hidden hinge digital micromirror device

A micromirror arrayfabricated on a semiconductor substrate. The arrayis comprised of four operating layers. An addressing layeris fabricated on the substrate. A raised electrode layeris spaced above the addressing layer by an air gap. A hinge layeris spaced above the raised electrode layerby another air gap. A mirror layeris spaced over the hinge layerby a third air gap.

Yokeless hidden hinge digital micromirror device with double binge layer

The present invention provides a method for manufacturing a digital micromirror device and a method for manufacturing a projection display system. The method for manufacturing the digital micromirror device may include providing a material stack, the material stack including a spacer layer having one or more openings therein and located over control circuitry located on or in a semiconductor substrate, a layer of hinge material located over the spacer layer and within the one or more openings, and a layer of hinge support material located over the layer of hinge material and within the one or more openings. The method may further include patterning the layer of hinge support material using photoresist, patterning the layer of hinge material using the patterned layer of hinge support material as a hardmask, and removing the patterned layer of hinge support material from over an upper surface of the patterned layer of hinge material.

Unique method for manufacturing a digital micromirror device and a method for manufacturing a projection display system using the same

A method of removing the pattern resist that remains on a microchip wafer after etching a patterned layer that is supported by a spacer layer. After the etch, the wafer is cleaned with a develop clean process that removes polymer residues from the pattern resist surface. Next is an ash to remove the hardened pattern resist surface, followed by removal of the pattern resist.

Method for removal of pattern resist over patterned metal having an underlying spacer layer

As robust hinge post structure for use with torsional hinged devices such as micromirrors and method of manufacturing is disclosed. The fabrication process uses a protective layer such as BARC on the bottom of the aperture used to form the hinge post structure to protect an oxide layer during an etching step. The oxide layer, in turn protects the metal layer at the bottom of the aperture. Therefore, the metal layer, the oxide layer, and the protective layer prevent the erosion and/or pitting of the bottom electrode during a cleaning process, and provide additional support to the structure.

Utilizing a protective plug to maintain the integrity of the FTP shrink hinge

A micromirror array fabricated on a semiconductor substrate. The array is comprised of three operating layers. An addressing layer is fabricated on the substrate. A hinge layer is spaced above the addressing layer by an air gap. A mirror layer is spaced over the hinge layer by a second air gap. The hinge layer has a hinge under and attached to the mirror, the hinge permitting the mirror to tilt. The hinge layer further has spring tips under the mirror, which are attached to the addressing layer. These spring tips provide a stationary landing surface for the mirror.

MEMS device deflection stop

Yokeless hidden hinge micromirror device with double binge layer

A micromirror arrayfabricated on a semiconductor substrateThe arrayis comprised of three operating layersAn addressing layeris fabricated on the substrate. A hinge layeris spaced above the addressing layerby an air gap. A mirror layeris spaced over the hinge layerby a second air gap. The hinge layerhas a hingeunder and attached to the mirrorthe hingepermitting the mirrorto tilt. Spring tipsunder the mirrorare attached to the underside of the mirrorThese spring tipstilt with the mirrorand provide a landing point for the mirroronto a surface of the underlying pixel element structure.

Digital micromirror device having mirror-attached spring tips

A micromirror arrayfabricated on a semiconductor substrateThe arrayis comprised of three operating layersAn addressing layeris fabricated on the substrate. A hinge layeris spaced above the addressing layerby an air gap. A mirror layeris spaced over the hinge layerby a second air gap. The hinge layerhas a hingeunder and attached to the mirror, the hingepermitting the mirrorto tilt. Spring tipsunder the mirrorare attached to the underside of the mirror. These spring tipstilt with the mirrorand provide a landing point for the mirroronto a surface of the underlying pixel element structure.

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Richardson, TX, United States of America

Anthony DiCarlo