Knowles Electronics, Inc.

Invensense, Inc.

Apple Inc.

Littelfuse, Inc.

Qualtre, Inc.

Littlefuse, Inc.

Anthony D Minervini

Aleksey Sergeyevich Khenkin

Peter C Hrudey

Ruchir M Dave

Kieran P Harney

Gokhan Hatipoglu

Louis Rector

Honorio S Luciano

Hugh M Hyatt

Thomas E Miller

Michael Julian Daneman

Baris Cagdaser

Brian H Kim

Stephen J Whitney

Jae Hyung Lee

Daniel Max Warren

Fang Liu

David Earl Schafer

Mekell Jiles

Janhavi S Agashe

Thinh K Nguyen

Hanny Sunarto

Carlo Murgia

Florence W Ow

Peter V Loeppert

James Robert Lim

Nikolas T Vitt

Fariborz Assaderaghi

Zijing Zeng

Charley T Ogata

Tavys Q Ashcroft

Ashish Shah

Andrew J Neuhalfen

Amin M Younes

James C Clements

Robert G Swensen

Marko Arciaga

David S Wilkes, Jr

Helia Rahmani

John K Queeney

Lawrence A Grunert

Jeffrey Niew

Thomas Restis

Yu-Chun Hsu

Joseph R Maurer

David Giesecke

Jiandong Yu

Wanfeng Huang

Andrew W S Elliott

Luciano Honorio

Sandra E Fritz

Ben Zheng

Style Liu

Thomas Edward Miller

David Earle Schafer

An acoustic device comprising: an enclosure defining an acoustic port and an acoustic pathway between the acoustic port and a transducer coupled to the enclosure; and an array of attenuators acoustically coupled to the acoustic pathway to absorb ultrasonic acoustic waves.

Acoustic wave attenuator for an electronic device

Aspects of the subject technology relate to inductive acoustic filters for acoustic devices. An inductive filter may include a substrate, an etched serpentine channel in a surface of the substrate and extending within the substrate from a first port in the substrate to a second port in the substrate. The inductive filter may also include a polymer cover layer adhesively attached to the surface of the substrate over the etched serpentine channel. The inductive filter may be positioned over an opening in a substrate of an acoustic module, such as a microphone module or a speaker module.

Inductive acoustic filters for acoustic devices

Aspects of the subject technology relate to liquid-resistant microphone modules for electronic devices. A microphone module may include a non-porous membrane that seals the front volume of the microphone module from the external environment of the electronic device. The microphone module may also include a substrate having an opening that allows airflow between the front volume and an interior cavity within the housing of the electronic device. In various implementations, an inductive vent and/or a resistive vent may be provided over the opening in the substrate.

Vented liquid-resistant microphone assembly

Embodiments described herein are directed to a temperature measurement device that includes a sensor body configured to be placed on a skin of a user. The temperature measurement device can include a first section defining a first lower surface and having a first thickness, a second section defining a second lower surface and having a second thickness, and a channel separating the first lower surface from the second lower surface. The temperature measurement device can also include a first set of temperature sensors positioned across the first thickness, a second set of temperature sensors positioned across the second thickness, and a processor configured to estimate a tissue temperature of the user based on comparing temperature signals from the first set of temperature sensors with temperature signals from the second set of temperature sensors.

Miniature external temperature sensing device for estimating subsurface tissue temperatures

Aspects of the subject technology relate to low noise microphone assemblies for electronic devices. A microphone assembly may include components for sensing sound, mounted on a substrate, under a cover disposed on the substrate. The components may receive sound through an opening in the substrate. The microphone assembly may include an interposer on the substrate. The interposer includes one or more contacts on a surface that is spatially separated from the surface of the substrate, in a direction perpendicular to the surface of the substrate. A first side of the substrate may be mounted to an inner surface of a housing of the electronic device. The components, the cover, and the interposer may be mounted to an opposing second side of the substrate. A flexible printed circuit may be coupled to the contacts on the surface of the interposer, and mechanically attached to a surface of the cover.

Sensor assembly for electronic device

A microphone assembly has an interconnect substrate and a microphone transducer coupled with the substrate. A lid overlies the microphone transducer. At least a portion of the lid is spaced from the substrate, defining an acoustic chamber for the microphone transducer. The lid can have a layer of discretized metal or other patterned conductor. The discretized layer of metal or other patterned conductor is configured to inhibit formation of eddy currents, as when exposed to electromagnetic radiation. The lid can be grounded. Microphone modules and electronic devices also are described.

Lids with a patterned conductor for microphone transducer packages, and associated modules and devices

Various embodiments provide for an integrated temperature sensor and microphone package where the temperature sensor is located in, over, or near an acoustic port associated with the microphone. This placement of the temperature sensor near the acoustic port enables the temperature sensor to more accurately determine the ambient air temperature and reduces heat island interference cause by heat associated with the integrated circuit. In an embodiment, the temperature sensor can be a thermocouple formed over a substrate, with the temperature sensing portion of the thermocouple formed over the acoustic port. In another embodiment, the temperature sensor can be formed on an application specific integrated circuit that extends into or over the acoustic port. In another embodiment, a thermally conductive channel in a substrate can be placed near the acoustic port to enable the temperature sensor to determine the ambient temperature via the channel.

Integrated temperature sensor in microphone package

A liquid-resistant microphone assembly includes a substrate defining a sound-entry region and a microphone transducer coupled with the substrate. The transducer has a sound-responsive region acoustically coupled with the sound-entry opening defined by the substrate. A liquid-resistant port membrane spans across the sound-entry opening defined by the substrate. The membrane is gas-permeable. An adhesive layer is positioned between the substrate and the liquid-resistant port membrane, coupling the liquid-resistant port membrane with the substrate and spacing the liquid-resistant port membrane from the substrate to form a gap between the membrane and the substrate. The adhesive layer defines an aperture having a periphery extending around and positioned outward of the sound-entry region. Modules and electronic devices incorporating such a microphone transducer also are disclosed.

Liquid-resistant packaging for electro-acoustic transducers and electronic devices

A surface mount package for a micro-electro-mechanical system (MEMS) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphone package has a cover, and the MEMS microphone die is substrate-mounted and acoustically coupled to an acoustic port provided in the surface mount package. The substrate and the cover are joined together to form the MEMS microphone, and the substrate and cover cooperate to form an acoustic chamber for the substrate-mounted MEMS microphone die.

Top port multi-part surface mount silicon condenser microphone

Top port multi-part surface mount MEMS microphone

A micro-electro-mechanical system (MEMS) transducer including an enclosure defining an interior space and having an acoustic port formed through at least one side of the enclosure. The transducer further including a compliant member positioned within the interior space and acoustically coupled to the acoustic port, the compliant member being configured to vibrate in response to an acoustic input. A back plate is further positioned within the interior space, the back plate being positioned along one side of the compliant member in a fixed position. A filter is positioned between the compliant member and the acoustic port, and the filter includes a plurality of axially oriented pathways and a plurality of laterally oriented pathways which are acoustically interconnected and dimensioned to prevent passage of a particle from the acoustic port to the compliant member.

Integrated particle filter for MEMS device

Integrated particle and light filter for MEMS device

An improved fuse element for use in a circuit protection fuse. The fuse element may include an insulating substrate portion and a conductive metallic portion disposed on at least one surface of the insulating substrate portion, wherein the metallic portion extends along, and is in continuous, intimate contact with the substrate portion. When the metallic portion melts and separates upon the occurrence of an overcurrent condition, the substrate portion bridges the resulting gap that is formed in the metallic portion and provides electrical arc suppression therein.

Composite fuse element and method of making

Systems and techniques for providing improved beam forming functionality and/or improve noise cancellation functionality in a microphone package are presented. In an implementation, a device includes a first microelectromechanical systems (MEMS) sensor, a second MEMS sensor, and a digital signal processor. The first MEMS sensor is contained in a first back cavity within the device. The second MEMS sensor is contained in a second back cavity within the device. The digital signal processor generates a cardioid microphone pattern based on data associated with the first MEMS sensor contained in the first back cavity and other data associated with the second MEMS sensor contained in the second back cavity, where the digital signal processor forms at least a portion of the first back cavity and the second back cavity.

Microphone package with an integrated digital signal processor

Growing community of inventors

Palos Hills, IL, United States of America

Anthony D Minervini