Modine Manufacturing Company

Anthony C DeVuono

C James Rogers

Stephen B Memory

Alfred L Phillips

Zhijun Zuo

Fredrick E Ganaway

A modular cooling system ( ) is provided for use in an electronics enclosure ( ) mounting a plurality of heat generating electronic components ( ). The cooling system ( ) includes a cooling liquid supply manifold ( ), a cooling liquid return manifold ( ), and a plurality of cooling modules ( ) that are selectively mountable into the electronic enclosure ( ). The cooling system ( ) also includes a wall ( ) fixed in the enclosure to separate the electronic components ( ) from the manifolds ( ) to shield the electronic components ( ) from any of the cooling liquid ( ) should it leak from the system ( ).

Growing community of inventors

Racine, WI, United States of America

Anthony C DeVuono