Motorola Corporation

Motorla, Inc.

Anthony B Suppelsa

Frank J Juskey, Jr

Dale W Dorinski

Anthony J Suppelsa

William B Mullen, Iii

Glenn F Urbish

Fadia Nounou

Robert W Pennisi

James L Davis

Kenneth R Thompson

Martin J McKinley

Henry F Liebman

Lonnie L Bernardoni

Jill L Flaugher

Thomas J Swirbel

Quirino Balzano

John M McKee

Leng H Ooi

Barry M Miles

Kingshuk Banerji

Douglas W Hendricks

Joaquin Barreto

Scott G Potter

Bruce J Freyman

Robert J Mulligan

William J Martin

Leonard F Altman

Gary Robert Geller

Robert F Darveaux

Francisco Da Costa Alves

Kenneth M Wasko

Barry Boaz Groman

M William Branan, Jr

Glenn E Gold

Michael F Shaw

Keith D Soldner

Michael L Weiss

Linda K Berrian

Lynne J Giacomino

John A De Santis

Frank J La Bate, Jr

John M Cook

John A Stoutland

Francisco De Costa Alves

A method of forming a high resolution metal pattern on a substrate. A temporary polyvinyl alcohol (10) layer underneath the photoresist layer (20) aids in removing the photoresist layer after plating. The photoresist is photodelineated in conventional manner to form a pattern (40). During photodelineation, the developing process for the resist does not completely remove the PVA (45) that lies directly under the removed resist, but instead reveals those portions of the polyvinyl alcohol layer. The substrate is then rinsed in a hot aqueous solution to effect removal of the revealed PVA portions, now exposing portions (40) of the substrate (15). Metal (50) is then electroplated to build up a metal circuitry pattern. The remaining portions of the photoresist and the PVA are then removed by a hot aqueous solution.

Method of forming high resolution circuitry by depositing a polyvinyl

A hazardous gas detection system is integrated into a wireless communication device such as a two-way radio. The radio has housing (102) with an opening (104) for receiving external air. A bellows-like device (114) has a first side (116) which is attached to an audio speaker diaphragm (112) by a rigid interconnect element (126). A fixed second side (118) of the bellows has first and second ports, 120 and 122. Vibrations from the speaker diaphragm are transferred to the bellows, causing the bellows to expand and contract. During bellows expansion, air is sucked into a first port (120) of the bellows. As the bellows contracts, the air is forced out through a second port (122) of the bellows and directed toward a gas sensor (132) mounted on an internal surface (106) of the radio housing. A warning mechanism in communication with the gas sensor provides forewarning of dangerously high gas concentration levels.

Gas detection system for a portable communication

An electrical circuit board (100) includes a substrate (101) on which a metallized bar code pattern (104) is disposed. The substrate (101) further includes an electrical circuit metallization pattern (103) which incorporates at least a portion of the metallized bar code pattern (104).

Electrical circuit board and circuit board assembly

An applicator (300) provides a tool for depositing processing media (510), such as a tacky flux agent, on predetermined surface areas (715) of a circuit substrate (705). The applicator (300) has a portion formed from a flexible compressible material with a surface (302, 325) patterned to have projections (325) that correspond in location to the predetermined surface areas (715) of the circuit substrate (705). The applicator (300) is preferably formed by polymerizing resin material using an image that corresponds to the circuit substrate (410, 420, 430).

Method of forming an applicator for applying tacking media to a circuit

A multi-layer circuit substrate (500 ) includes at least two substrate layers (130, 150). The first substrate layer (130) has an insulating material (100) with two opposing surfaces (101, 102), and a hole (105) extending between the two surfaces (101, 102). A conductive pattern (110) is formed on a first surface (101) of the insulating material (100) and completely covers the hole (105). The second substrate layer (150) is attached along the second surface (102) of the insulating material (100), and also includes a conductive pattern (155) on insulating material. A conductive material (140) is disposed within the hole (105) that engages the first and second conductive patterns (110, 155).

Multilayer circuit substrate and method for forming same

An assembly (5) has two or more plastic parts joined together. One of the plastic parts (20) has an electrical heating element (31) whose function is to soften a portion of the plastic when the heating element is electrically energized. Once the plastic is softened, the two parts can be separated and the assembly disassembled. When the two parts are joined together with snap-fit joints, the snap-fits have a heating element to soften a portion of the snap-fit (24) when the heating element is electrically energized, thereby allowing the housing to be opened and separated. If the two parts are ultrasonically welded together to form a housing, a heating element is located therein to soften the ultrasonically welded portion (44), thereby allowing the two halves of the housing to be separated. The heating element can be a nichrome or thin film resistor that is energized by a source (33) located within the housing, or by an power source external to the housing, or it may be inductively coupled to the power source.

Housing with integral opening feature

A soldering composition is self melting and is auto-regulating. The solder composition (100) has a central core (102) made from a non-magnetic metal. A coating (105) of a magnetic material surrounds most or all of the central core. A solder layer (108) overlies the coating of magnetic material, and the solder layer has a melting temperature that is lower than the Curie temperature of the magnetic material. The auto-regulating temperature substantially corresponds to the Curie temperature. When the solder composition is placed in a field of alternating current, the magnetic material heats up and melts the solder coating. When the Curie temperature is reached, the magnetic material stops heating, thus controlling the maximum temperature of the soldering composition. As the temperature of the composition drops below the Curie temperature, the magnetic material again heats up, thus keeping the temperature of the solder constant.

Auto-regulating solder composition

A method of making a transfer molded chip carrier. A semiconductor device (10) is first electrically and mechanically attached to a substrate (12). The substrate (12) is then treated by sputter etching so that it will provide good adhesion between the substrate and a molding compound (18) that is subsequently molded to the substrate (25). Portions of the treated substrate are then selectively contaminated in order to reduce the adhesion between these selected portions of the substrate and the molding compound. The molding compound is then formed around the semiconductor device so as to encapsulate it and also part of the surface of the substrate. Portions (20) of the transfer molded material that were molded over the selectively contaminated portions of the substrate (12) are then removed by breaking away.

Method of selectively releasing plastic molding material from a surface

Housing with integral thin film resistive snap-fits

A plastic leaded semiconductor package (20) has a semiconductor device (614) encapsulated in the package and mounted to a lead frame (612). The lead frame has a plurality of leads (622) that extend beyond the body (610) of the encapsulated package. Each of the plurality of leads is made from a metal having a predetermined coefficient of thermal expansion. A second metal (627) with a different coefficient of thermal expansion is disposed on at least one portion of each of the leads.

Leaded semiconductor package having temperature controlled lead length

A multichip circuit package is formed for use with an EPROM chip. The active circuitry on the EPROM die surface is revealed. An EPROM die (14) is mounted on an insulating substrate (10). The active circuitry (15) on the die is connected to a conductive circuit pattern (13) on the substrate by wire bonds (16) between the die and the conductive circuit pattern. A second integrated circuit die (20) is also mounted on the substrate and electrically connected to the conductive circuit pattern by wire bonds. A plastic material (50) is then molded to encapsulate the perimeter (18) of the EPROM and the associated thin wires, the entire second integrated circuit die and it's associated thin wires, at least a portion of the conductive circuit pattern, and portions of the insulating substrate. The plastic material is formed so as to expose the active circuitry on the face of the EPROM.

Light erasable multichip module

A method of manufacturing a circuit carrying substrate having one or more coaxial via holes. The center core or inner layer (330) of the circuit carrying substrate is a dielectric material that has a plated (339) through hole or via (335) coupling the two surfaces of the inner layer together. One side of the inner layer has a first metallization pattern (336) and the other side has a second metallization pattern (338) on it. The through hole is electrically conductive (339) and connects portions of the first and second metallization patterns. The plated through hole is filled with a dielectric material (340). A first dielectric layer (342) is formed on one side of the inner layer, and a second dielectric layer (344) is formed on the other side of the inner layer, so that the dielectric layers cover the first and second metallization patterns and the filled via hole. A third metallization pattern (350) is formed on the first dielectric layer, and a fourth metallization pattern (360) is formed on the second dielectric layer. A second via hole (370) is formed within the first via hole, substantially concentric to and electrically insulated from the first via hole, to electrically connect the third and fourth metallization patterns.

Method of manufacturing a circuit carrying substrate having coaxial via

An encapsulated electronic component having an integral heat diffuser. The heat producing electronic component (10) is mounted on a substrate carrier (12) and a layer of encapsulant material (16) covers the component. A layer of thermally conductive material (18) is applied over the encapsulant material, and then a second layer of encapsulant material (20) is applied over the thermally conductive material. The heat generated by the component is distributed throughout the thermally conductive material, thereby eliminating the hot spot over the component, resulting in a substantially lower surface temperature.

Encapsulated electronic component having a heat diffusing layer

A self centering coil (200) includes a coil section (202) and also having curved end section (206) and (204) at opposite sides of the coil section (202). The curved end sections are preferably substantially flat and in a plane which is parallel to the center axis (306) of the coiled section (202).

Self centering coil

A semiconductor device package comprises a substrate (10), a flip-chip (16), an underfill adhesive (25), and a thermally and electrically conductive plastic material (20). A leadless circuit carrying substrate has a metallization pattern (13) on a first side (15), one portion of the metallization pattern being a circuit ground (17). The second side has an array of surface mount solder pads (24) electrically connected to the metallization pattern by means of at least one conductive via (26) through the substrate. A semiconductor device (16) is flip-chip mounted to the metallization pattern by means of metal bumps (22). An underfill adhesive (25) fills the gap between the semiconductor device and the substrate. A thermally and electrically conductive plastic material (20) containing metal particles is transfer molded to encapsulate the semiconductor device, the underfill adhesive, and a portion of the first side of the leadless circuit carrying substrate, forming a cover. The conductive plastic material is electrically connected to the circuit ground to shield the semiconductor device from radio frequency energy, and is mechanically attached to the semiconductor device to dissipate heat. Fins (28) may be molded into the conductive plastic material to further enhance the ability to dissipate heat.

Thermally conductive integrated circuit package with radio frequency

Growing community of inventors

Coral Springs, FL, United States of America

Anthony B Suppelsa