Advanced Micro Devices Corporation

Globalfoundries Inc.

Anthony Andric

Ruel Hill

David L Wigton

Doug Markwardt

Lewis M Eyman

Paul Devriendt

Various integrated circuit voltage regulation apparatus and methods of assembling the same are provided. In one aspect, an apparatus is provided that has a stack that includes a heat sink and a semiconductor chip. The semiconductor chip has a conductive heat transfer pathway to the heat sink. A voltage regulator member is electrically coupled to the semiconductor chip and coupled to the heat sink, but is not positioned in the stack.

Variable mount voltage regulator

A power subsystem including a mechanism for satisfying a predetermined power limit in a computer system. The power subsystem may include a split power supply and a voltage regulator. The split power supply may include at least a first voltage supply line and a second voltage supply line. The voltage supply lines may be closely matched voltage sources, each configured to provide relatively the same voltage amount. The voltage regulator may step-down a voltage provided by each of the first and second voltage supply lines to generate a desired voltage for a load. The first voltage supply line may be isolated from the second voltage supply line to limit power provided through either the first or the second voltage supply line from exceeding a predetermined power limit. The predetermined power limit may be a power limit set by U.L. standard #60950, i.e., 250 Watts.

Split power supply subsystem with isolated voltage supplies to satisfy a predetermined power limit

A first package for an integrated circuit has both a first set of electrical contacts and a first connector. A second package has a second set of electrical contacts and a second connector. The first and the second connector are mating connectors that are electrically and physically coupled. The first set of electrical contacts and the first connector are disposed on opposite surfaces of the first package and the second set of electrical contacts and the second connector are disposed on the same surface of the second package. The first and second set of electrical contacts couple to a printed circuit board directly or indirectly through a socket. The connectors allow higher speed signals to be routed over the first and second connectors, while power, ground and slower speed signals can be routed over the first set and second set of electrical contacts.

Method and apparatus for direct connection between two integrated circuits via a connector

A semiconductor device includes a casing, a semiconductor die supported by the casing, at least one contact pad disposed on a bottom surface of the semiconductor device, and a plurality of external contacts extending from the casing and being coupled to the semiconductor die. A circuit assembly includes a printed circuit board, a semiconductor device, and a socket. The semiconductor device includes a casing, a semiconductor die supported by the casing, at least one contact pad disposed on a bottom surface of the semiconductor device, and a plurality of external contacts extending from the casing and being coupled to the semiconductor die. The socket is coupled to the printed circuit board and adapted to receive the semiconductor device. The socket includes a first plurality of contacts adapted to interface with the external contacts of the semiconductor device and at least one base contact adapted to interface with the contact pad.

Semiconductor device having signal contacts and high current power contacts

A conductive plane of an integrated circuit package and a heatsink combine to form a structure for controlling electromagnetic emissions from the integrated circuit die that is mounted in the package. The heatsink includes a base and a projecting portion extending from the base. The projecting portion is electrically connected to an exposed ground plane in the package. The projecting portion defines a recess positioned over the integrated circuit die, which thermally engages the integrated circuit die.

Method and apparatus for shielding electromagnetic emissions from an integrated circuit

A heat transfer apparatus is described for coupling to a pin grid array (PGA) device including an integrated circuit and mounted within a socket (e.g., a zero insertion force or ZIF socket). The socket is mounted upon a surface of a printed circuit board (PCB) and includes two latching projections extending from opposite side surfaces. The heat transfer apparatus includes a thermally conductive heat sink and a spring clip for holding the heat sink in position relative to the PGA device. The heat sink may be made from a metal (e.g., aluminum), and may have multiple structures (e.g., fins or pins) extending from an upper surface. The heat sink has an opening in an underside surface for housing the PGA device and the socket. The heat sink also has a lip surrounding the opening for thermally coupling to the PCB about the socket. The heat sink also has a pair of holes extending through the heat sink from the upper surface of the heat sink into the opening. The spring clip has two side members each adapted for attaching to a different one of the two latching projections of the socket. Each of the pair of holes in the heat sink is positioned to receive a different one of the side members of the spring clip. Methods for coupling a heat sink to the PGA device using the spring clip and removing the installed spring clip are also described.

Removable heat transfer apparatus for a pin grid array (PGA) device, and associated installation and removal methods

A lift mechanism is provided that facilitates removal of an integrated circuit from a socket. Such a socket includes a base portion and a cover that slidably engages with the base portion. An actuation device moves the cover laterally with respect to the base. A lift mechanism responds to the cover moving in a first lateral direction into an open position in which the integrated circuit can be removed from the socket, by moving at least partially in an upward direction sufficiently to displace the integrated circuit away from the socket, thereby more easily allowing the integrated circuit to be grasped and removed from the socket.

Method and apparatus for lifting an integrated circuit from a socket

A semiconductor device package, and a semiconductor device employing the package, are described. The semiconductor device package is intended for housing an integrated circuit (IC), and includes a substrate adapted to receive the IC. The substrate includes a surface (e.g., an underside surface) having an outer portion surrounding a center portion. A first group of signal terminals are arranged about the outer portion of the surface, and a second group of power supply terminals are arranged about the center portion. Placing the power supply terminals in the center portion of the surface reduces the lengths of power supply current paths within the substrate, thus reducing IR voltage drops within the substrate. The power supply terminals are made physically larger than the signal terminals such that the electrical resistances of the power supply terminals are lower than the electrical resistances of the signal terminals.

Semiconductor device including and integrated circuit housed in an array package having signal terminals arranged about centrally located power supply terminals

An integrated circuit package includes a semiconductor die, a base, and a plurality of external contacts. The base is coupled to the semiconductor die and includes at least one contact pad coupled to the semiconductor die. The plurality of external contacts extend from the base and are coupled to the semiconductor die. A circuit assembly includes a printed circuit board, an integrated circuit package, and a socket. The integrated circuit package includes a semiconductor die, a base coupled to the semiconductor die, and a plurality of external contacts extending from the base and being coupled to the semiconductor die. The base includes at least one contact pad coupled to the semiconductor die. The socket is coupled to the printed circuit board and adapted to receive the base. A contact is adapted to interface with the contact pad and one of the printed circuit board and the socket.

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Lockhart, TX, United States of America

Anthony Andric