Lam Research Corporation

Anthony Amadio

Hong Shih

John Edward Daugherty

Duane Outka

Lin Xu

Sivakami Ramanathan

Robert G O'Neill

John Michael Kerns

Tae Won Kim

Peter Holland

Sonia Castillo

Components of semiconductor material processing chambers are disclosed, which may include a substrate and at least one corrosion-resistant coating formed on a surface thereof. The at least one corrosion-resistant coating is a high purity metal coating formed by a cold-spray technique. An anodized layer can be formed on the high purity metal coating. The anodized layer comprises a process-exposed surface of the component. Semiconductor material processing apparatuses including one or more of the components are also disclosed, the components being selected from the group consisting of a chamber liner, an electrostatic chuck, a focus ring, a chamber wall, an edge ring, a plasma confinement ring, a substrate support, a baffle, a gas distribution plate, a gas distribution ring, a gas nozzle, a heating element, a plasma screen, a transport mechanism, a gas supply system, a lift mechanism, a load lock, a door mechanism, a robotic arm and a fastener. Methods of making the components and methods of plasma processing using the components are also disclosed.

Corrosion resistant aluminum coating on plasma chamber components

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Mountain View, CA, United States of America

Anthony Amadio