Biotronik Se Co. Kg

Anthony A Primavera

Alok Sharan

Adam Birge

Kevin Pickup

A system and method for marking components of an assembly and/or portions of an assembly including at least one of the components with a plurality of markers, each component and/or portion including its own marker or markers, to be read in an operational sequence so as to generate at least one identifier representative of a characteristic and/or feature of the assembly. Any marker can be a certain type of marker, the combination of which can be used to generate an identifier. A certain type of markerneed not be dedicated to a certain component. Each marker can be associated with a proxy value, which can be obtained by reading the marker with a reader. An identifier of the assembly can then be generated by employing a predetermined sequence of reading the markers.

Identification of miniaturized electronic assembly using identification features on multiple components

A method for manufacturing devices built on flexible substrates employs an in-situ, fold-assisting device frame. The fold-assisting frame conforms to a portion of the interior volume within the package, such that one or more pivoting members of the frame may be used as an in-situ, bending jig, in place of conventional bending equipment, to support and fold the planar flexible substrate into a desired three-dimensional configuration. The frame may accommodate placement of an unfolded or partially folded flexible circuit board so that a fold-assisting feature, such as a hinge, incorporated into the frame attaches to the flexible circuit board and closes around a pivot point to gently bend the circuit board into place, thus creating a three-dimensional folded circuit. Such a fixture and method facilitate packaging electronic devices in a compact form, with application to a wide range of mobile consumer electronics, including, for example, implantable medical devices.

Method of folding flexible substrate in-situ using fold-assisting frame

A semiconductor package and a carrier for a semiconductor package are provided, the carrier having a top surface and a bottom surface separated by side walls. The carrier includes a seat for a component, and at least one terminal region for electrically connecting the component to the carrier when mounted to the seat, wherein a test portal is arranged at an outer surface of the carrier, and wherein one or more routing paths are arranged in the carrier for routing one or more electrical contacts arranged at the carrier to the test portal.

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Newberg, OR, United States of America

Anthony A Primavera