Cardiac Pacemakers, Inc.

Anthony A Primavera

Howard Lee Bentley

Orrin Paul Lorenz

David J Smith

Steven P Findell

Vijesh Unnikrishnan

A test apparatus for determining layer-to-layer misregistration of a multiple layer printed circuit board having an electrical test pattern formed on an inner layer and an electrical test reference formed on an outer layer with the reference electrically connected to the pattern. The apparatus includes a holder for the board, an electrical input device that moves into and out of connection with the reference when the board is in the holder, with the input device adapted to provide a signal to the reference, and an electrical output probe configured to move into and out of electrical connection with the pattern when the board is in the holder. The output probe is adapted to receive at least one signal from the pattern when a signal is provided to the reference, such that the signal received by the output probe conveys layer-to-layer misregistration between the inner layer and the outer layer.

System for multiple layer printed circuit board misregistration testing

This document discusses, among other things, a method including providing a laminate having a first conductive layer, a second conductive layer and an insulator between the first and second conductive layers. A hollow conductive via is formed through the insulator, the conductive via electrically connects the first and second conductive layers. At least one conductive trace electrically connects the hollow conductive via to at least one of the first and second conductive layers. The method further includes forming a channel in the insulator adjacent to the hollow conductive via and the channel surrounds the via. Wherein the channel extends at least part way between the first and second conductive layers, the at least one conductive trace bridges the channel, and the via is isolated from the insulator by the surrounding channel formed adjacent to the hollow conductive via. The via is isolated to prevent separation between the hollow conductive via and at least one of the first and second conductive layers, where the insulator is in a swollen condition.

Method of making a thermally isolated via structure

Apparatus and methods for flattening thin substrate surfaces by stretching thin flexible substrates to which ICs can be bonded. Various embodiments beneficially maintain the substrate flatness during the assembly process through singulation. According to one embodiment, the use of a window frame type component carrier allows processing of thin laminates and flex films through various manufacturing processes. The flexible substrate is bonded to a rigid carrier. The carrier is placed into a specialized fixture comprising a bottom plate and a top plate. The bottom plate with raised regions is created that allows the windowed region of the flex film to be pressed flat. After aligning the top plate, the bottom plate, and the middle structure, the plates are pressed together causing the raised regions to push the flex film substrate upward and around the carrier. By pressing the thin substrate upward, the substrate is stretched like a drum head over the raised sections of the bottom plate, thereby flattening the substrate. The die assembly site is held flat overtop of the raised portion of the carrier to provide a stable vase for placement of the die.

Flip chip die assembly using thin flexible substrates

A method of testing for misregistration in a multiple layer printed circuit board includes providing an electrical test pattern on one or more layers of the board, testing for an electrical signal between the test pattern and a test reference, and determining layer-to-layer misregistration based on the results of the testing. A method of manufacturing a multiple layer board that is configured to facilitate non-destructive testing of layer-to-layer misregistration includes forming an electrical test pattern on a first layer and forming a corresponding electrical test reference on a second layer. Then, a connecting pathway is formed between the test reference and the test pattern, including the first and second layers, with testing for an electrical signal between the test reference and the test pattern determining layer-to-layer misregistration of the first layer with respect to the second layer.

Multiple layer printed circuit board having misregistration testing pattern

This document discusses, among other things, a flexible circuit or other laminate comprising a first conductive layer and a second conductive layer disposed over the first conductive layer. An insulator is disposed between the first and second conductive layers. A conductive via extends through the insulator and electrically connects the first and second conductive layers. The laminate includes a channel in the insulator. In one option, the channel extends at least part way around the via. In another option, the channel extends at least part way between the first and second conductive layers. In another example, a method comprises providing a laminate including at least first and second conductive layers and an insulator disposed therebetween. A via is formed through the insulator. A channel is formed in the insulator at least part way around the via. The channel extends between the first and second conductive layers.

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Anoka, MN, United States of America

Anthony A Primavera