The Dexter Corporation

Loctite Corporation

Henkel Locktite Corporation

Dexter Electronic Materials Div. of Dexter Corp.

Dexter Electronic Materials Division of Dexter Corp.

Dexter Electronics Materials Division, Dexter Corporation

Dextor Corporation

Henkel Loctite Corporation

Anthony A Gallo

Flame retardant molding compositions that are substantially free of halogen, phosphorus, and antimony are disclosed. Also disclosed is the use of these flame retardant molding compositions to coat electronic devices such as integrated circuits. The flame retardant molding compositions include an epoxy resin; a first transition metal oxide containing a refractory metal, such as tungsten trioxide; and a second transition metal oxide containing an oxyanion of a Group VIA element and a cation of a Group IIA element, such as calcium molybdate.

Flame retardant molding compositions

Flame retardant molding compositions that are substantially free of halogen, phosphorus, and antimony are disclosed. Also disclosed are the use of these flame retardant molding compositions to coat electronic devices such as integrated circuits.

The invention relates to a method of preparing a polybenzoxazine which includes heating a molding composition including a benzoxazine and a heterocyclic dicarboxylic acid to a temperature sufficient to cure the molding composition, thereby forming the polybenzoxazine. Also disclosed are a method of preparing a polybenzoxazine composition having near-zero volume change after post cure and a method of coating a device using a polybenzoxazine composition of this invention.

Method for preparing polybenzoxazine

A flame retardant epoxy molding compound comprises an epoxy, a hardener preferably of the novolac or anhydride type, a catalyst, a mold release agent, preferably a filler, preferably a colorant, preferably a coupling agent, an organic compound containing a halogen (which can be part of the resin or the hardener), and an oxidizing refractory metal oxide, preferably on oxidizing metal oxide of an element selected from the Group VIA of the Periodic Table. The flame retardant epoxy molding compounds when used to encapsulated semiconductor devices have synergistic flame retardant properties.

Flame retardant epoxy molding compound, method and encapsulated device

A flame retardant epoxy molding compound comprises an epoxy, a hardener preferably of the novolac or anhydride type, a catalyst, a mold release agent, preferably a filler, preferably a colorant, preferably a coupling agent, an organic compound containing a higher percent of halogen (which can be part of the resin or the hardener), preferably the meta-brominated cresol epoxy novolac type, preferably containing at least about 0.5% of bromine by weight of the molding compound, a lower percent of sodium, preferably in the range of 0.03-0.06% by weight of the antimony pentoxide, a lower percent of antimony pentoxide, preferably in the range of from less than about 0.8% by weight of the molding compound, and an amount of magnesium aluminum carbonate hydrate less than or about 4.0% by weight of the molding compound. The flame retardant epoxy compounds when used to encapsulated the semiconductor devices have improved high temperature stability and reliability compared to similar prior art molding compounds.

Flame-retardant epoxy molding compound

Semiconductor device encapsulated with a flame retardant epoxy molding

An improved flame retardant epoxy molding compound comprises an epoxy, a hardener preferably of the novolac or anhydride type, a catalyst, a mold release agent, preferably a filler, preferably a colorant, preferably a coupling agent, an organic compound containing a higher percent of halogen (which can be part of the resin or the hardener), preferably the polyglycidyl ether of the bromophenol-formaldehyde novolac type, preferably containing at least about 1.0% of bromine by weight of the molding compound, a lower percent of sodium, preferably in the range of 0.03-0.06% by weight of the antimony pentoxide, a lower percent of antimony pentoxide, preferably in the range of .ltoreq. about 0.8% by weight of the molding compound, and an amount of bismuth trioxide .ltoreq. about 4.0% by weight of the molding compound. The improved flame retardant epoxy molding compounds when used to encapsulated semiconductor devices have improved high temperature stability and compatability, ball-lift performance, live-device performance, cost and lower toxicity compared to similar prior art molding compounds.

Flame retardant epoxy molding compound for encapsulating a semiconductor

An improved flame retardant epoxy molding compound comprises an epoxy, a hardener preferably of the novolac or anhydride type, a catalyst, a mold release agent, preferably a filler, preferably a colorant, preferably a coupling agent, an organic compound containing a higher percent of halogen (which can be part of the resin or the hardener), preferably the polyglycidyl ether of the bromophenol-formaldehyde novolac type, preferably containing at least about 1.0% of bromine by weight of the molding compound, a lower percent of sodium, preferably in the range of 0.03-0.06% by weight of the antimony pentoxide, a lower percent of antimony pentoxide, preferably in the range of .ltoreq. about 0.8% by weight of the molding compound, and an amount of bismuth trioxide .ltoreq. about 4.0% by weight of the molding compound. The improved flame retardant epoxy molding compounds when used to encapsulated semiconductor devices have improved high temperature stability and compatibility, ball-lift performance, live-device performance, cost and lower toxicity compared to similar prior art molding compounds.

A method of preparing an organosilazane including reacting a first halosilane having the formula RR.sup.1 SiX.sub.2, wherein X is F, Cl, Br, or I, and each R and R.sup.1, independently, is X, H, or a lower alkyl group; a first primary amine compound having the formula R.sup.2 NH.sub.2, wherein R.sup.2 is H or a lower alkyl group; and a second primary amine compound having the formula R.sup.3 NH.sub.2, wherein R.sup.3 is H or a lower alkyl group, R.sup.3 being different from R.sup.2, to form the organosilazane.

Method of preparing a polysilazane

A flame retardant epoxy molding compound comprises an epoxy, a hardener preferably of the novolac or anhydride type, a catalyst, a mold release agent, preferably a filler, preferably a colorant, preferably a coupling agent, an organic compound containing a higher percent of halogen (which can be part of the resin or the hardener), preferably the meta-brominated cresol epoxy novolac type, preferably containing at least about 0.5% of bromine by weight of the molding compound, a lower percent of sodium, preferably in the range of 0.03-0.06% by weight of the antimony peroxide, a lower percent of antimony pentoxide, preferably in the range of from less than about 0.8% by weight of the molding compound, and an amount of magnesium aluminum carbonate hydrate less than or about 4.0% by weight of the molding compound. The flame retardant epoxy compounds when used to encapsulate the semiconductor devices have improved high temperature stability and reliability compared to similar prior art molding compounds.

An improved flame retardant epoxy molding compound comprises an epoxy, a hardener preferably of the novolac or anhydride type, a catalyst, a mold release agent, preferably a filler, preferably a colorant, preferably a coupling agent, an organic compound containing a higher percent of halogen (which can be part of the resin or the hardener), preferably the polyglycidyl ether of the bromophenol-formaldehyde novolac type, preferably containing at least about 1.0% of bromine by weight of the molding compound, a lower percent of sodium, preferably in the range of 0.01-0.06% by weight of the antimony pentoxide, a lower percent of antimony pentoxide, preferably in the range of from about 0.4 to about 0.8% by weight of the molding compound, and an amount of bismuth trioxide from about 1.6 to about 4.0% by weight of the molding compound. The improved flame retardant epoxy compounds when used to encapsulated semiconductor devices have improved high temperature stability and compatability, ball-lift performance, live-device performance, cost and lower toxicity compared to similar prior art molding compounds.

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Olean, NY, United States of America

Anthony A Gallo