Intel Corporation

Altera Corporation

Anshuman Thakur

Md Altaf Hossain

Ankireddy Nalamalpu

Hemal Vinodchandra Shah

Mahesh K Kumashikar

Ramacharan Sundararaman

Ramon Matas

Steven Chang

Sujoy Sen

Anil Vasudevan

Dheeraj R Subbareddy

Linden Cornett

David B Minturn

Gary Tsao

Atsuo Kuwahara

Karthik Veeramani

Brent E Insko

Sandeep B Sane

Atul Maheshwari

Zhengmin Li

Arvind S Tomar

Robert F Netting

Daniel A Manseau

DongHo Hong

Jay S Lawlor

Abdul Rahman Ismail

Rahul Pal

Robert W Cone

Roy Callum

Dheemanth Nagaraj

Itay Franko

Daniel S Klowden

Kemal Aygün

Elazar Cohen

Mark W Wunderlich

Frank C Verhoorn, Iii

Casey Thielen

Dheeraj Subareddy

Rajesh Vivekanandham

Nicholas A Colman

Ramesh S Krishnan

A semiconductor device may include a programmable fabric and a processor. The processor may utilize one or more extension architectures. At least one of these extension architectures may be used to integrate and/or embed the programmable fabric into the processor as part of the processor. Systems and methods for transitioning data between the programmable fabric and the processor associated with different clock domains is described.

Flexible instruction set architecture supporting varying frequencies

The present disclosure is directed to 3-D stacked architecture for Programmable Fabrics and Central Processing Units (CPUs). The 3-D stacked orientation enables reconfigurability of the fabric, and allows the fabric to function using coarse-grained and fine-grained acceleration for offloading CPU processing. Additionally, the programmable fabric may be able to function to interface with multiple other compute chiplet components in the 3-D stacked orientation. This enables multiple compute components to communicate without the need for offloading the data communications between the compute chiplets.

Three-dimensional stacked programmable logic fabric and processor design architecture

A processor package module comprises a substrate, one or more compute die mounted to the substrate, and one or more photonic die mounted to the substrate. The photonic die have N optical I/O links to transmit and receive optical I/O signals using a plurality of virtual optical channels, the N optical I/O links corresponding to different types of I/O interfaces excluding power and ground I/O. The substrate is mounted into a socket that support the power and ground I/O and electrical connections between the one or more compute die and the one or more photonic die.

Processor package with universal optical input/output

A processor having a system on a chip (SOC) architecture comprises one or more central processing units (CPUs) comprising multiple cores. An optical Compute Express Link (CXL) communication path incorporating a logical optical CXL protocol stack path transmits and receives an optical bit stream directly after the link layer, bypassing multiple levels of the CXL protocol stack. A CXL interface controller is connected to the one or more CPUs to enable communication between the CPUs and one or more CXL devices over the optical CXL communication path.

Low-latency optical connection for CXL for a server CPU

Embodiments herein relate to systems, apparatuses, or processes for improving off-package edge bandwidth by overlapping electrical and optical serialization/deserialization (SERDES) interfaces on an edge of the package. In other implementations, off-package bandwidth for a particular edge of a package may use both an optical fanout and an electrical fanout on the same edge of the package. In embodiments, the optical fanout may use a top surface or side edge of a die and the electrical fanout may use the bottom side edge of the die. Other embodiments may be described and/or claimed.

Electrical and optical interfaces at different heights along an edge of a package to increase bandwidth along the edge

Computers for supporting multiple virtual reality (VR) display devices and related methods are described herein. An example computer includes a graphics processing unit (GPU) to render frames for a first VR display device and a second VR display device, a memory to store frames rendered by the GPU for the first VR display device and the second VR display device, and a vertical synchronization (VSYNC) scheduler to transmit alternating first and second VSYNC signals to the GPU such that a time period between each of the first or second VSYNC signals and a subsequent one of the first or second VSYNC signals is substantially the same. The GPU is to, based on the first and second VSYNC signals, alternate between rendering a frame for the first VR display device and a frame for the second VR display device.

Computers for supporting multiple virtual reality display devices and related methods

In one embodiment, a method is provided. The method of this embodiment provides storing a packet header at a set of at least one page of memory allocated to storing packet headers, and storing the packet header and a packet payload at a location not in the set of at least one page of memory allocated to storing packet headers.

Header replication in accelerated TCP (transport control protocol) stack processing

Following a restart or a reboot of a system that includes a multi-core processor, the multi-core processor may assign one of the cores as a boot strap processor (BSP). Initialization logic may detect a state of each of the plurality of processing cores as active or inactive. The initialization logic may detect an attribute of each of the plurality of processing cores as eligible to be assigned as a BSP or as ineligible to be assigned as the BSP. The initialization logic may detect a last processing core of the plurality of processing cores in the interconnect that is an active processing core based at least in part on the state and is eligible to be assigned as the BSP based at least in part on the attribute. In various embodiments, the initialization information may assign the last processing core as the BSP.

Boot strap processor assignment for a multi-core processing unit

An initialization core may include reset logic that may detect a global reset signal (GRS). The initialization core may generate one or more packets that enable communication with the cores. The initialization core may send reset packets to each of the cores that instruct the cores to perform a reset. In some embodiments, the reset command may power-off the cores. The initialization core may then transmit unreset packets to each of the cores that instruct the cores to perform an unreset and power-on the cores. In some embodiments, the cores may resume operation automatically without receipt of the unreset packet. The transmission of the packets may be staggered (staged) to control the power-on of the processor and enable the processor unit to more slowly increase its power state.

Reset of multi-core processing system

Following a restart or a reboot of a system that includes a multi-core processor, the multi-core processor may assign each active and eligible core a unique advanced programmable interrupt controller (APIC) identifier (ID). Initialization logic may detect a state of each of the plurality of processing cores as active or inactive. The initialization logic may detect an attribute of each of the plurality of processing cores as eligible to be assigned an APIC ID or as ineligible to be assigned the APIC ID.

Advanced programmable interrupt controller identifier (APIC ID) assignment for a multi-core processing unit

This disclosure is directed to use of shared initialization and configuration vectors, which are delivered to processing cores in a multi-core processor using packets. An initialization core may include reset logic that may read initialization and configuration vectors from a centralized storage location, which may be on a die containing the processing cores (e.g., a fuse, etc.), off the die (e.g., in volatile memory, flash memory, etc.), or a combination of both. The initialization core may then generate packets to transmit the initialization and configuration vectors to processing cores that await initialization (e.g., following a reset). In some instances, the initialization and configuration vector information may be shared by two or more cores of a same type.

Initialization of multi-core processing system

This disclosure is directed to performing a controlled reset of one or more cores while maintaining operation of at least one other core in a multi-core processor. An initialization core may include reset logic that may detect a problematic core or core that is unresponsive or otherwise not operating properly. The initialization core may generate a packet that enables communication with the problematic core. The initialization core may send a reset packet to the problematic core to instruct the problematic core to perform a reset.

Reset of processing core in multi-core processing system

Header replication in accelerated TCP (Transport Control Protocol) stack processing

Growing community of inventors

Beaverton, OR, United States of America

Anshuman Thakur