Robert Boschgmbh

Annette Seibold

Manfred Moser

Werner Gruenwald

Claudio De La Prieta

Walter Roethlingshoefer

Ralf Haug

Reiner Schuetz

Karl-Hermann Friese

Harald Neumann

Susumu Nishigaki

Gerhard Schneider

Kurt Schmid

Hans-Joerg Renz

Uwe Glanz

Ulrich Goebel

Gerhard Benz

Klaus-Michael Mayer

Andreas Reppich

Kurt Bayha

Carmen Schmiedel

Klaus Steinle

Wolfgang Golderer

G&uuml;nther Stecher

Stefan Kuschel

A heat dissipation arrangement for chip modules on multilayer ceramic substrates, in particular multichip modules, in which passages for a heat-conducting medium are provided in the ceramic substrate. The multilayer ceramic substrate is mounted on a metal heat sink. Thermal passages, in particular in the form of a hole pattern or array, are provided in the top layer of the multilayer ceramic substrate, in the region of the chip to be mounted. A cavity functioning as an evaporation chamber is provided in the layer of the multilayer ceramic substrate directly beneath the top layer, in the region of the chip to be mounted, and a trough-shaped recess functioning as a condenser is provided in the metal heat sink, in the region of the chip to be mounted. In the layers of the multilayer ceramic substrate located between the evaporation chamber and the condenser, in the region of these two chambers, a series of large steam channels and small condensate channels, the latter functioning as capillaries is provided, which interconnect these two chambers. This arrangement forms a miniaturized heat pipe structure which can transport a great amount of energy per unit of time across short distances.

Arrangement for heat dissipation in chip modules on multilayered ceramic carriers, in particular multichip modules

A high-dielectric lead-free paste serves for the manufacture of at least one area having a high dielectric constant in a ceramic multilayer circuit. The lead-free dielectric paste is basically made of barium titanate nano powder of a suitable particle size and sinters at temperatures below 1000.degree. C., preferably in a range of 800.degree. C. to 1000.degree. C.

Dielectric paste

Arrangement for converting optical signals into electrical signals and

A force sensor has a measuring diaphragm adapted to undergo a deflection in response to a force being applied thereto. The force sensor further has a test deflection device operatively coupled to the measuring diaphragm for effecting a test deflection thereof independently of any force external to the force sensor being applied to the measuring diaphragm.

Force sensor having test deflection device

Electrochemical measuring sensor and method for producing an

Ceramic multilayer substrates as circuit supports for complex electronic circuits wth integrated capacitors are manufactured by printing capacitor structures, using the screen printing process, directly onto a first green ceramic film. The first green ceramic film with the printed structures is arranged in a stack with further green ceramic films, laminated, and fired. During lamination of the ceramic films, the printed structures are pressed into the ceramic films so that after firing, a multilayer substrate with integrated capacitors results.

Method for manufacturing a ceramic multilayer substrate for complex

In a method for producing a multilayer circuit, it is possible to produce capacitor structures including electrodes and a dielectric arranged in between. By pressing the capacitor structures into a ceramic layer, it is possible to produce a high-quality capacitor inside the multilayer circuit.

Method for producing a multilayer circuit

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Rutesheim, Germany

Annette Seibold