Epcos Ag

Annette Fischer

Sebastian Brunner

Stefan Leopold Hatzl

Christian Faistauer

Edmund Payr

Gerhard Fuchs

Guenter Pudmich

Manfred Fischer

Franz Kaul

A method for patterning a layer stack with at least one ceramic layer includes providing the ceramic layer, which has at least one plated-through hole. An electrically conductive layer is applied above the ceramic layer, such that the electrically conductive layer is electrically coupled to the at least one plated-through hole. A further layer is deposited onto the electrically conductive layer in the region of the at least one plated-through hole, wherein the further layer includes nickel. The electrically conductive layer is removed outside the region of the at least one plated-through hole. A carrier device patterned in this way can be electrically and mechanically coupled to an electronic component.

Carrier device, arrangement comprising such a carrier device, and method for patterning a layer stack comprising at least one ceramic layer

A module substrate includes a multilayer substrate that includes a plurality of layers, a bottommost of the layers being a ceramic layer. Solderable contacts, which include fired pads composed of a conductive paste, are applied to the bottommost ceramic layer. A covering layer overlies the pads. The covering layer covers all outer edges of the pads. A window is cut out of the covering layer. A metallic coating is applied to each pad exclusively within the window.

Module substrate and production method

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Lannach, Austria

Annette Fischer