International Business Machines Corporation

Annayya P Deshpande

Kevin Thuy Luong

Calvin S Lo

Artemio Juan Torres

Abel J Taina

Hoodin Hamidi

Sassan K Shahidi

Icko E Iben

Robert G Biskeborn

Mark Anthony Church

Alain M Desouches

Michael Paul Salo

Muhammad Inayet Ullah

Randall T Kerth

George S Pal

Artemio-Juan Torres

Henri M Nier

An electronic component, comprising: a portion of a row cut from a wafer; and a closure coupled to the portion of the row of the wafer towards a first edge of the portion of the row of the wafer; the portion of the row of the wafer having a bonding area positioned adjacent a second edge of the portion of the row of the wafer, the second edge of the portion of the row of the wafer being positioned opposite the first edge of the portion of the row of the wafer and along a same side thereof, wherein the bonding area includes a layer of adhesive thereon.

Electronic component and tape head having a closure

A tape head read/write module that has a composite air bearing surface, and a method and apparatus for embedding a chip in a substrate to form a composite air bearing surface. An example of the module includes a substrate that has an air bearing surface, a front, a back, and a chip receiving slot. The air bearing surface of the substrate has a first portion adjoining a first side of the chip receiving slot, and a second portion adjoining a second side of the chip receiving slot. The module also includes a chip that has an air bearing surface, a bottom surface, a front, a back, and active elements. The active elements are located proximate the front of the chip. The chip is positioned in the chip receiving slot in the substrate, with the air bearing surface of the chip substantially aligned with the air bearing surface of the substrate.

Tape head read/write module

An electronic component according to one embodiment comprises a portion of a row cut from a wafer; and a closure coupled to the portion of the row of the wafer towards a first edge of the portion of the row of the wafer; the portion of the row of the wafer having a bonding area positioned adjacent a second edge of the portion of the row of the wafer, the second edge of the portion of the row of the wafer being positioned opposite the first edge of the portion of the row of the wafer and along a same side thereof, wherein the bonding area includes a layer of adhesive thereon, wherein the adhesive coupled to the bonding area is spaced from the closure. Additional systems and methods are also presented.

A magnetic head according to another embodiment includes a head body including a top face, a bottom face, a pair of elongated side faces, and a pair of short end faces; at least one transducer formed in communication with the top face of the head body; and a single groove formed in the top face of the head body and extending between the transducers and one of the side faces of the head body. A method for manufacturing a magnetic head is also presented.

Thin-film tape head having single groove formed in head body and corresponding process

A method and apparatus for embedding a chip in a substrate to form a composite air bearing surface. An example of the method includes securing the substrate in a fixed position, aligning the chip in a first direction with a chip receiving slot in the substrate, depositing adhesive in the chip receiving slot, and aligning the chip in a second direction with the chip receiving slot. The chip is pushed into the adhesive in the chip receiving slot until the air bearing surface of the chip is substantially at a desired protrusion in a third direction in relation to the air bearing surface of the substrate. The adhesive is cured with the air bearing surface of the chip substantially at the desired protrusion in the third direction, and with the chip substantially aligned in the first and second directions with chip receiving slot.

Method and apparatus for embedding a chip in a substrate to form a composite air bearing surface

A method and mechanism for slicing a thin film wafer. A closure is bonded to a section of a thin film wafer. A blade is used to slice a row from the section of the wafer by cutting through the closure and thin film wafer such that opposite sides of the blade engage an equal surface area of the closure.

Row slicing method in tape head fabrication

A precision clamping apparatus is described which is suitable for use with a high temperature curing process. A clamp according to the invention includes a base plate with a supporting surface for a component (which consists of two portions to be bonded together), and at least two alignment stops against which the first and second sides of the component can be pressed. A pressure plate is provided to mate with the base plate to exert uniform clamping force on the component to allow a uniform thickness of cured adhesive to form between internal surfaces of the component. The pressure plate is precisely aligned with the supporting surface in the horizontal plane by guides which allow vertical movement. The pressure plate is made self-aligning with the surface of the component by being urged toward the supporting surface by a resilient structure which is in turn held in position by attachment to the base plate. Adjustable lateral fingers are provided to urge the component against the alignment stops.

Precision bonding method and apparatus

A novel thin film magnetic head fabrication process is provided for fabricating a plurality of thin film magnetic head elements. The process begins with the selection of an appropriate wafer substrate of suitable size and quality. At least two primary sub-areas of the wafer substrate are designated as work areas for the deposition of magnetic recording transducer elements. The work areas have first and second end portions and are arranged in mutually adjacent relation along a shared boundary zone that extends in a first direction through the wafer substrate between the first and second end portions. The wafer substrate is populated with plural rows of magnetic recording transducer elements in the designated work areas such that the plural rows extend in a second direction that is substantially perpendicular to the first direction. The work areas are separated from the wafer substrate and magnetic transducer slider elements are fabricated from the plural rows of magnetic recording transducer elements. The process steps are such that they reduce the number of fabrication steps to a minimum while increasing the consistency of throat and stripe heights.

Thin film magnetic head fabrication method

A method for making a magnetic head slider comprising the steps of lapping the slider to form an air bearing surface, producing a chosen pattern of rails on the air bearing surface, and producing a chosen pattern of stress on the back side of the slider to remove the distortion produced in the slider by the lapping and rail formation steps. The stress pattern can be chosen to produce any desired range of crown and camber for the slider.

Process for independent control of crown and camber for magnetic head

A lapping control system for a row of thin film magnetic transducers formed on a substrate. Each of the magnetic transducers comprises a magnetoresistive (MR) element, and the row is supported on a holder which has an elongated H-shaped slot near one edge to form a beam member upon which the row is mounted. The beam member is capable of being deflected in a substantially quadratic curvature when subjected to pressure from a pressure transducer at the middle of the beam member. The resistance of each of the MR elements is measured during lapping, and a control signal is generated to control the pressure transducers to control lapping with proper BALANCE and BOW and to terminate lapping when the desired MR element height is reached.

Growing community of inventors

San Jose, CA, United States of America

Annayya P Deshpande