Apple Inc.

Annabelle Q Yang

Howell John Chua Toc

Prakash Venkatesappa

Steven Webster

Reynaldo Vincent H Sta Agueda

Melvin C Cabonegro

Gerard Anthony C Afable

Kok Peng Teo

Kolan Ravi Kanth

Christopher Hunat

An image sensor device includes a substrate, a die, and an adhesive layer positioned between the substrate and the die. The substrate includes a first side having a curved surface. The die includes an image sensor component attached to the curved surface of the substrate. At least a portion of the die comprising the image sensor component has a curved surface. The adhesive layer positioned between the curved surface of the substrate and the die provides a fixed attachment between the die and the substrate.

Bending a circuit-bearing die

A camera module includes an image sensor, a flexible printed circuit with a first side affixed to a first side of the image sensor, a plurality of metallic leads affixed to a second side of the image sensor, and a lens assembly for directing light to the image sensor articulated to the image sensor by one or more of an overmolding attached to the leads and the flexible printed circuit. The first side of the image sensor is a side opposite the second side of the image sensor. The leads provide connection between the image sensor and leads in the flexible printed circuit.

Camera module design with lead frame and plastic moulding

A camera module assembly including a circuit carrier substrate having a first region integrally formed with a second region, the second region being movable with respect to the first region. The camera module assembly may further include an image sensor device positioned within a cavity formed in the first region of the circuit carrier substrate. The image sensor device may have a conductive via and a redistribution layer formed therein. The conductive via and the redistribution layer are electrically connected to the circuit carrier substrate along the side of the image sensor device facing the circuit carrier substrate. The camera module assembly further includes an electronic component positioned within a second cavity formed in the first region, the electronic component being electrically connected to the circuit carrier substrate.

Camera module in a unibody circuit carrier with component embedding

A method and clamping apparatus for securing a substrate within a substrate carrier during an ultrasonic mounting process. The clamping apparatus may include a substrate carrier having a top plate and a bottom plate, the top plate and the bottom plate forming a cavity dimensioned to hold a substrate. A clamping plate is positioned on a side of the top plate opposite the bottom plate, the clamping plate having an opening aligned with the cavity and a pair of clamping members, each of the pair of clamping members extending toward a center of the opening and through the cavity such that the clamping member presses portions of the substrate exposed through the opening against the bottom plate. The method may include providing a clamping plate having an opening configured for alignment with a cavity formed in a substrate carrier and mounting a pair of resilient arms to the clamping plate.

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Singapore, Singapore

Annabelle Q Yang