Applied Materials, Inc.

Anna Marie Lloyd, Legal Representative

Yezdi N Dordi

Robin W Cheung

Avi Tepman

Ratson Morad

Ashok K Sinha

Dan A Marohl

Michael N Sugarman

Donald J Olgado

Joseph Stevens

Ho Seon Shin

Mark Robert Denome

Peter W Hey

Dan Carl

George Birkmaier

Eugene Ravinovich

The present invention provides an electro-chemical deposition system that is designed with a flexible architecture that is expandable to accommodate future designs and gap fill requirements and provides satisfactory throughput to meet the demands of other processing systems. The electro-chemical deposition system generally comprises a mainframe having a mainframe wafer transfer robot, a loading station disposed in connection with the mainframe, one or more processing cells disposed in connection with the mainframe, and an electrolyte supply fluidly connected to the one or more electrical processing cells. Preferably, the electro-chemical deposition system includes a spin-rinse-dry (SRD) station disposed between the loading station and the mainframe, a rapid thermal anneal chamber attached to the loading station, and a system controller for controlling the electro-chemical deposition process and the components of the electro-chemical deposition system.

Electro-chemical deposition system

Growing community of inventors

Fremont, CA, United States of America

Anna Marie Lloyd, Legal Representative