Alpha Assembly Solutions Inc.

Other

Alpha Metals, Inc.

Anna Lifton

Bawa Singh

Oscar Khaselev

Nitin Vithalbhai Desai

Michael T Marczi

Monnir Boureghda

Siuli Sarkar

Rahul Raut

Ranjit Pandher

Sathish Kumar

Sutapa Mukherjee

Sanyogita Arora

Narahari Pujari

Ravi Bhatkal

Nirmalya Kumar Chaki

Paul Koep

Remya Chandran

Pavan Vishwanath

Shamik Ghosal

Bogdan Bankiewicz

Angelo Gulino

Ashok Pachamuthu

Girard Sidone

Morgana De Avila Ribas

Paul Salerno

Morgana Ribas

Paul J Koep

A solder material comprising a solder alloy and a thermal conductivity modifying component. The solder material has a bulk thermal conductivity of between about 75 and about 150 W/m-K and is usable in enhancing the thermal conductivity of the solder, allowing for optimal heat transfer and reliability in electronic packaging applications.

Solder material and method for die attachment

Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300&#xb0; C. or less to attach the die to the substrate. Devices produced using the methods are also described.

Methods for attachment and devices produced using the methods

A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.

Sintering paste

Sintering powder

Flux formulations that remain pliable and tack-free after deposition are disclosed. In certain examples, the flux comprises a first component and an effective amount of a second component to provide a pliable flux after deposition. The flux may also include activators, plasticizers, surface active agents and other components.

Flux formulations

Methods for attachment of a die to a substrate are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300&#xb0; C. or less to attach the die to the substrate.

Methods of attaching a die to a substrate

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Bridgewater, NJ, United States of America

Anna Lifton