Interuniversitair Micro-electronica Centrum, Vzw

Siemens N.v.

Siemens Aktiengesellschaft

Ann Dumoulin

Eric Beyne

Marcel Heerman

Jean Joseph Roggen

Rita Van Hoof

Recai Sezi

Rainer Leuschner

Siegfried Birkle

Hellmut Ahne

Albert Hammerschmidt

Tobias Noll

Polymer stud grid array for microwave circuit arrangements

Polymer stud grid array

A method for manufacturing multichip modules having layer sequences made of dielectric material with conducting tracks embedded therein is characterized by the following features: (1) a temperature-resistant, base-resistant polymer having a dielectric constant .ltoreq.3 is used as a dielectric material, which is applied to a non-conductive substrate and serves as an edge boundary for currentless, autocatalytic build-up of the conducting tracks; (2) the dielectric material is provided with a layer made of material which is soluble in organic solvents (lift-off layer); (3) the dielectric material and the lift-off layer are structured in a single lithographic step, either a direct or an indirect structuring taking place and grooves having an aspect ratio .gtoreq.1 being formed in the dielectric material; (4) a metallic seed layer is applied to the dielectric material or rather to the lift-off layer through vapor deposition in a directed manner; (5) the lift-off layer is removed using an organic solvent; and (6) conducting tracks are created in the grooves through currentless metal deposition.

Connection and build-up technique for multichip modules

Growing community of inventors

Zedelgem, Belgium

Ann Dumoulin