Lam Research Corporation

Anjun Jerry Jin

Tuan Anh Nguyen

Xuyen Pham

David Wei

Ren Zhou

Tony Luong

Sridharan Srivatsan

Joseph P Simon

Katgenhalli Y Ramanujam

Linda Jiang

A temperature controlling system for use in a chemical mechanical planarization (CMP) system having a linear polishing belt, a carrier capable of applying a substrate over a preparation location over the linear polishing belt is provided. The temperature controlling system includes a platen having a plurality of zones. The temperature controlling system further includes a temperature sensor configured determine a temperature of the linear polishing belt at a location that is after the preparation location. The system also includes a controller for adjusting a flow of temperature conditioned fluid to selected zones of the plurality of zones of the platen in response to output received from the temperature sensor.

Method and apparatus for heating polishing pad

Growing community of inventors

Milpitas, CA, United States of America

Anjun Jerry Jin