Henkel Ag & Company, Kgaa

Other

Nederlandse Organisatie Voor Toegepast-natuurwetenschappelijk Onderzoek Tno

Anja Henckens

Gunther Dreezen

Liesbeth Theunissen

Jing Yang

Rudolf Oldenzijl

Chao B Zhang

Jeroen Van Den Brand

Yazhou Zhang

Qili Wu

Stijn Gillissen

Sascha Poeller

Inge Van Der Meulen

Yifan Chen

Sven Wucherpfennig

Marc Estruga Ortiga

Elisabeth Theunissen

Nabila Idrissi

Ashok Sridhar

Bart Van Remoortere

Kily Wu

The present invention relates to an electrically conductive composition comprising a silicone resin comprising at least one vinyl-group; a silicone cross-linker having at least one Si—H group; electrically conductive particles; a solvent; an adhesion promoter; a catalyst; and an inhibitor, wherein ratio between Si—H groups and vinyl-groups is equal or greater than 1.3 but equal or less than 10.

Electrically conductive silicone composition with high adhesion strength

The present invention relates to an electrically conductive composition comprising a) a resin selected from the group consisting of epoxy (meth)acrylate, (poly)ester (meth)acrylate, urethane (meth)acrylate, silicone (meth)acrylate, poly(iso)butylene (meth)acrylate, (poly)isoprene (meth)acrylate, polybutylene (meth)acrylate and mixtures thereof; b) an acrylic monomer; c) an electrically conductive filler; and d) a curing agent. The composition is particularly suitable for use in a solar cell and/or a photovoltaic module, especially in the photovoltaic module, wherein the solar cells are shingled.

Electrically conductive adhesive for attaching solar cells

The present invention relates to a conductive paste composition for solar photovoltaic cells comprising metal particles dispersed in a suitable carrier therefor, wherein said carrier comprises a solvent and a resin, and wherein at least a portion of said metal particles are characterized by having a &#x3c8; value, as defined by X-ray diffraction&#x3c;0.0020, having at least 50% degree of crystallinity, and being anisotropic with respect to crystallographic direction.

Sinterable composition for use in solar photovoltaic cells

The present invention relates to a process of forming electrical conductor on a substrate comprising the steps of a) providing a substrate; b) providing an electrically conductive composition; c) applying said electrically conductive composition to at least one part of said substrate; and d) exposing said electrically conductive composition on the substrate to a near infrared light to form an electrical conductor. NIR light cure provides improved electrical properties of the cured composition without damaging heat sensitive substrates.

Processing of polymer based inks and pastes

The present disclosure relates to a method for curing a heat-curable material () in an embedded curing zone () and an assembly resulting from such method. The method comprises providing a heat-conducting strip () partially arranged between a component () and a substrate () that form the embedded curing zone () therein between. The heat-conducting strip () extends from the embedded curing zone () to a radiation-accessible zone () that is distanced from the embedded curing zone () and at least partially free of the component () and the substrate (). The method further comprises irradiating the heat-conducting strip () in the radiation-accessible zone () by means of electromagnetic radiation (). Heat () generated by absorption of the electromagnetic radiation () in the heat-conducting strip () is conducted from the radiation-accessible zone () along a length of the heat-conducting strip () to the embedded curing zone () to cure the heat-curable material () by conducted heat () emanating from the heat-conducting strip () into the embedded curing zone ().

Curing a heat-curable material in an embedded curing zone

The present invention relates to adhesives that are suitable for use as electrically conductive materials in the fabrication of electronic devices, integrated circuits, semiconductor devices, solar cells and/or solar modules. The adhesives comprise at least one resin component, at least one nitrogen-containing curative, at least one low melting point metal filler, and optionally at least one electrically conductive filler, which is different from the metal filler.

Electrically conductive adhesives

The present invention relates to curable compositions that are suitable for use as electrically conductive materials in the fabrication of electronic devices, integrated circuits, semiconductor devices, passive components, solar cells, solar modules, and/or light emitting diodes. The curable compositions comprise a) one or more curable resins; b) composite particles, which comprise i) an electrically conductive core, and ii) an electrically conductive shell, comprising one or more shell materials each selected from the group consisting of metal carbides, metal sulfides, metal borides, metal silicides, and metal nitrides; and c) electrically conductive particles different from component b). The present invention further relates to a method of bonding a first substrate to a second substrate, wherein the substrates are bonded under heat and pressure using said curable composition.

Curable compositions comprising composite particles

The present invention relates to adhesives that are suitable for use as electrically conductive materials in the fabrication of electronic devices, integrated circuits, semiconductor devices, passive components, solar cells, solar modules, and/or light emitting diodes. The adhesive of the present invention comprises one or more epoxy resins, silver-coated particles having a silver content of 2 to 30 wt.- %, based on the total amount of the silver-coated particles, and one or more amine-epoxy adducts, comprising one or more functional groups, each derived from an alkyl-substituted nitrogen-containing heterocycle.

Growing community of inventors

Zonhoven, Belgium

Anja Henckens