Applied Materials, Inc.

Aniruddh Jagdish Khanna

Rajeev Bajaj

Daniel Redfield

Jason Garcheung Fung

Gregory E Menk

Mayu Felicia Yamamura

Mario Dagio Cornejo

Veera Raghava Reddy Kakireddy

Nag B Patibandla

Boyi Fu

Ashwin Chockalingam

Mahendra Christopher Orilall

Hou Tee Ng

Fred Conrad Redeker

Ashavani Kumar

Robert E Davenport

Venkat Hariharan

Amritanshu Sinha

John Watkins

Sivapackia Ganapathiappan

Yingdong Luo

You Wang

Puneet Narendra Jawali

Nandan Baradanahalli Kenchappa

Adam Wade Manzonie

Joonho An

Jaeseok Kim

Raghava Kakireddy

Rob Davenport

Venkatachalam Hariharan

Chemical mechanical polishing (CMP) apparatus and methods for manufacturing CMP apparatus are provided herein. CMP apparatus may include polishing pads, polishing head retaining rings, and polishing head membranes, among others, and the CMP apparatus may be manufactured via additive manufacturing processes, such as three dimensional (3D) printing processes. The CMP apparatus may include wireless communication apparatus components integrated therein. Methods of manufacturing CMP apparatus include 3D printing wireless communication apparatus into a polishing pad and printing a polishing pad with a recess configured to receive a preformed wireless communication apparatus.

Techniques for combining CMP process tracking data with 3D printed CMP consumables

Embodiments herein generally relate to polishing pads and methods of forming polishing pads. A polishing pad includes a plurality of polishing elements. Each polishing element comprises an individual surface that forms a portion of a polishing surface of the polishing pad and one or more sidewalls extending downwardly from the individual surface to define a plurality of channels disposed between the polishing elements. Each of the polishing elements has a plurality of pore-features formed therein. Each of the polishing elements is formed of a pre-polymer composition and a sacrificial material composition. In some cases, a sample of the cured pre-polymer composition has a glass transition temperature (T) of about 80° C. or greater. A storage modulus (E′) of the cured pre-polymer composition at a temperature of 80° C. (E′80) can be about 200 MPa or greater.

Polishing pads for high temperature processing

Polishing pads having discrete and selectively arranged regions of varying porosity within a continuous phase of polymer material are provided herein. In one embodiment a polishing pad features a plurality of polishing elements each comprising a polishing surface and sidewalls extending downwardly from the polishing surface to define a plurality of channels disposed between the polishing elements, wherein one or more of the polishing elements is formed of a continuous phase of polymer material having one or more first regions comprising a first porosity and a second region comprising a second porosity, wherein the second porosity is less than the first porosity.

Polishing pads having selectively arranged porosity

Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.

Polishing pads produced by an additive manufacturing process

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Fremont, CA, United States of America

Aniruddh Jagdish Khanna