International Business Machines Corporation

The University of Texas System

Anil Yuksel

Damon B Farmer

Mark Kenneth Hoffmeyer

Chee Seng Foong

Abram L Falk

Jose A Hejase

Nilabh Kumar Roy

David Michael Green

Michael Cullinan

Junyan Tang

Joshua C Myers

Pavel Roy Paladhi

Edni Del Rosal

A multi-chip package structure is provided. The multi-chip package structure includes a first IC chip and a second IC chip, and a fluid conduit thermally coupled to the first IC chip and the second IC chip. The multi-chip package structure is configured to remove heat generated by at least one of the first IC chip and the second IC chip. The fluid conduit has a first end and a second end opposite to the first end. The multi-chip package structure also includes a first monopole feed connected between the first IC chip and the first end of the fluid conduit, and a second monopole feed connected between the second IC chip and the second end of the fluid conduit. The first monopole feed is configured to transmit an electromagnetic signal through the fluid conduit toward the second monopole feed and vice versa.

Electromagnetic waveguiding through liquid cooling conduit

A nanotube polariton quantum dot photon source device includes a substrate. A nanotube is arranged on the substrate, and an incident light source is configured to generate an exciton-plasmon polariton excitation in the nanotube. The nanotube emits a photon in response to the generated exciton plasmon polariton excitation. The nanotube has a length L<50 nm to emit one or more photons at a desired frequency.

Polariton quantum dots comprising ultrashort carbon nanotubes

A thermal interface material, a process of forming a thermal interface, the thermal interface including the thermal interface material, and an article of manufacture including the thermal interface material, where the thermal interface material includes polar nanoparticles embedded in one or more carrier materials. The polar nanoparticles may have a diameter of approximately 50-60 nanometers or less, and near-field radiative coupling between the polar nanoparticles. The process of forming the thermal interface including: obtaining the polar nanoparticles; adding the polar nanoparticles to one or more carrier materials to form a carrier mixture, where the polar nanoparticles are embedded in the one or more carrier materials; creating a thermal interface material using the carrier mixture; applying the thermal interface material to a first electronics component and a second electronics component; and compressing the electronics components, where the compressing densely packing the polar nanoparticles.

Thermal interface materials with radiative coupling heat transfer

A circuit board and method of manufacture therefor utilize voltage domain edge plating disposed on at least a portion of one or more edges of a circuit board to electrically couple voltage domain conductive shapes disposed in different conductive layers of the circuit board. By doing so, interconnection of multiple voltage domain conductive shapes in different conductive layers may be facilitated with improved power integrity, while also providing EMI shielding along the edge of the circuit board.

Printed circuit board shielding and power distribution via edge plating

A microscale selective laser sintering (&#x3bc;-SLS) that improves the minimum feature-size resolution of metal additively manufactured parts by up to two orders of magnitude, while still maintaining the throughput of traditional additive manufacturing processes. The microscale selective laser sintering includes, in some embodiments, ultra-fast lasers, a micro-mirror based optical system, nanoscale powders, and a precision spreader mechanism. The micro-SLS system is capable of achieving build rates of at least 1 cm/hr while achieving a feature-size resolution of approximately 1 &#x3bc;m. In some embodiments, the exemplified systems and methods facilitate a direct write, microscale selective laser sintering &#x3bc;-SLS system that is configured to write 3D metal structures having features sizes down to approximately 1 &#x3bc;m scale on rigid or flexible substrates. The exemplified systems and methods may operate on a variety of material including, for example, polymers, dielectrics, semiconductors, and metals.

Micro-selective sintering laser systems and methods thereof

Growing community of inventors

Austin, TX, United States of America

Anil Yuksel