Applied Materials, Inc.

Anil Kumar Kalal

Jay D Pinson, Ii

Jennifer Y Sun

Andrew Nguyen

Kallol Bera

Ren-Guan Duan

Canfeng Lai

Sean M Seutter

Wendell Glenn Boyd, Jr

Sudhir R Gondhalekar

Kaushik Comandoor Alayavalli

Badri N Ramamurthi

Hanish Kumar Panavalappil Kumarankutty

Sathya Swaroop Ganta

Akshay Dhanakshirur

Shekhar Athani

Job George Konnoth Joseph

Abhishek Pandey

Embodiments of the disclosure provide electrostatic chucks for securing substrates during processing. Some embodiments of this disclosure provide methods and apparatus for increased temperature control across the radial profile of the substrate. Some embodiments of the disclosure provide methods and apparatus for providing control of hydrogen concentration in processed films during a high-density plasma (HDP) process.

Electrostatic chuck with improved temperature control

A plasma chamber includes a chamber body having a processing region therewithin, a liner disposed on the chamber body, the liner surrounding the processing region, a substrate support disposed within the liner, a magnet assembly comprising a plurality of magnets disposed around the liner, and a magnetic-material shield disposed around the liner, the magnetic-material shield encapsulating the processing region near the substrate support.

Magnetic-material shield around plasma chambers near pedestal

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Bengaluru, India

Anil Kumar Kalal