Applied Materials, Inc.

Anhthu Ngo

Schubert S Chu

Kartik Bhupendra Shah

Paul Brillhart

Nyi O Myo

Anzhong Chang

Zhepeng Cong

Kin Pong Lo

Edric Tong

Kevin Joseph Bautista

Zhiyuan Ye

Yi-Chiau Huang

Xuebin Li

Balasubramanian Ramachandran

Zuoming Zhu

James Francis Mack

Richard Omar Collins

Karthik Ramanathan

Nitin Pathak

Manish Hemkar

In one embodiment, a susceptor for thermal processing is provided. The susceptor includes an outer rim surrounding and coupled to an inner dish, the outer rim having an inner edge and an outer edge. The susceptor further includes one or more structures for reducing a contacting surface area between a substrate and the susceptor when the substrate is supported by the susceptor. At least one of the one or more structures is coupled to the inner dish proximate the inner edge of the outer rim.

Thermal processing susceptor

Implementations of the present disclosure generally relate to a susceptor for thermal processing of semiconductor substrates. In one implementation, the susceptor includes a first rim surrounding and coupled to an inner region, and a second rim disposed between the inner rim and the first rim. The second rim includes an angled support surface having a plurality of cut-outs formed therein, and the angled support surface is inclined with respect to a top surface of the inner region.

Susceptor design to reduce edge thermal peak

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San Jose, CA, United States of America

Anhthu Ngo