Silverbrook Research Pty Ltd

Memjet Technology Limited

Zamtec Limited

Angus John North

Kia Silverbrook

Gregory John McAvoy

Samuel George Mallinson

Jennifer Mia Fishburn

Mehdi Azimi

Paul Justin Reichl

Brian Robert Brown

Samuel James Myers

Philip Palma

John Robert Sheahan

Roger Mervyn Lloyd Foote

Christopher Barton

Paul David Lunsmann

Matthew Stewart Walker

Ronan O'Reilly

Simon Robert Walmsley

Michael John Webb

Mark Jackson Pulver

Richard Thomas Plunkett

Geordie McBain

Jognandan Prashar

Graeme Lowe

Alireza Moini

Timothy Peter Gillespie

Brian Christopher Morahan

Alexandra Artemis Papadakis

Elmer Dimaculangan Perez

See-Huat Tan

Julie Catherine Hogan

Rodney Hardy

Witold Roman Wiszniewski

Caitriona Forbes

Glenn Horrocks

Marcelle Louisa Gannon

Chia-An Lin

Duncan McRae

Benjamin Powell

Frederik Jacobus Crous

Channarayapatna Shankar Lakshmi

Mile Jurevic

Sam Myers

Gregory John Mcavoy

Richard Dimagiba

Peter Allworth

Nicolas Arnal

David Keeshan

Colin Pickup

Kieran Roughan

William Jacob

Jeff Tsang

Jeffrey Tsang

Troy Pasiola Quimpo

Lakshmi Channarayapatna

Lakshmi Channarayapatna Shankar

Frederik Jacobus Clous

David Secker

John Gregory Mcavoy

Gregory Mcavoy

Duncan Mcrae

Sam Mallinson

C S Lakshmi

Lakshmi CS

Roger Mervyn Foote

Lakshmi Cs

Matthew Walker

Geordie Mcbain

Christopher Saul Barton

An inkjet nozzle device includes a main chamber having a floor, a roof and a perimeter wall extending between the floor and the roof. The main chamber includes: a firing chamber having a nozzle aperture defined in the roof and a bar heater for ejection of ink through the nozzle aperture; an antechamber for supplying ink to the firing chamber, the antechamber having a chamber inlet defined in the floor; and a baffle plate extending parallel with the bar heater, which partitions the main chamber to define the firing chamber and the antechamber. The nozzle device has mirror symmetry about a symmetry plane extending perpendicular to the longitudinal axes of the bar heater and the baffle plate.

Compact inkjet nozzle device with high degree of symmetry

A MEMS chip assembly includes: a support structure having a chip mounting surface; a MEMS chip mounted on the chip mounting surface, the MEMS chip having an active surface including one or more rows of MEMS devices and a row of bond pads disposed alongside a connection edge of the MEMS chip and parallel with the rows of MEMS devices; electrical connectors connected to the bond pads; and an encapsulant material covering the electrical connectors. The MEMS chip has a plurality of trenches defined in the active surface, the trenches extending parallel with the rows of MEMS devices and disposed between the bond pads and the MEMS devices. The encapsulant material does not encroach past the trenches towards the MEMS devices.

MEMS chip assembly having multiple trenches

A wafer assembly for use in a MEMS fabrication process. The wafer package includes: a MEMS wafer having a first side and an opposite second side; a silicone-free peel tape releasably attached to the first side of the wafer; a wafer bonding tape attached to the peel tape; and a carrier substrate releasably attached to the first wafer bonding tape.

Wafer assembly for MEMS fabrication

A process for handling MEMS wafers includes the steps of: (i) attaching a first carrier substrate to a first side of a MEMS wafer, the first carrier substrate being attached via a first wafer bonding tape and a silicone-free peel tape, the peel tape contacting the first side of the MEMS wafer; (ii) performing wafer processing steps on an opposite second side of the MEMS wafer; (iii) releasing the first carrier substrate from the first side of the MEMS wafer via exposure to an energy source, the energy source selectively releasing the wafer bonding tape from the first side of the MEMS wafer; and (iv) peeling the peel tape away from the first side of the MEMS wafer.

Process for handling MEMS wafers

A MEMS chip assembly including: a support structure having a chip mounting surface; a MEMS chip mounted on the chip mounting surface, each MEMS chip having an active surface including one or more MEMS devices and a plurality of bond pads disposed alongside a connection edge of the MEMS chip; electrical connectors connected to the bond pads; and an encapsulant material covering the electrical connectors. The MEMS chip has encapsulant-retaining trenches defined in the active surface extending alongside the connection edge, each encapsulant-retaining trench being disposed between the bond pads and the MEMS devices.

Inkjet printhead with encapsulant-retaining features

An inkjet printhead includes: an elongate support having a printhead mounting surface; a plurality of butting printhead chips mounted on the printhead mounting surface, each printhead chip having an ink ejection surface including one or more nozzle rows; and a grout material disposed between butting edges of each butting pair of printhead chips. Each printhead chip has a grouting trench defined in the ink ejection surface, the grouting trench extending alongside at least one butting edge and the grouting trench being disposed between an endmost nozzle of each nozzle row and the butting edge.

Inkjet printhead with grout retaining features

A process for forming inkjet nozzle devices on a frontside surface of a wafer substrate. The process includes the steps of: (i) providing the wafer substrate having a plurality of etched holes defined in the frontside surface, each etched hole being filled with first and second polymers such that the second polymer is coplanar with the frontside surface; (ii) forming the inkjet nozzle devices on the frontside surface using MEMS fabrication steps; and (iii) removing the first and second polymers via oxidative ashing, wherein first and second polymers are different.

Process for forming inkjet nozzle devices

A process for filling one or more etched holes defined in a frontside surface of a wafer substrate. The process includes the steps of: depositing a layer of a thermoplastic first polymer onto the frontside surface and into each hole until the holes are overfilled with the first polymer; depositing a layer of a photoimageable second polymer different than the first polymer; selectively removing the second polymer from regions outside a periphery of the holes; exposing the wafer substrate to a controlled oxidative plasma so as to reveal the frontside surface of the wafer substrate; and planarizing the frontside surface to provide holes filled with a plug of the first polymer only, each plug having a respective upper surface coplanar with the frontside surface.

Process for filling etched holes using first and second polymers

A method of multi-color printing in a single pass using a fixed pagewide array of monochrome inkjet printheads. The printheads are aligned with each other in a media feed direction and the method includes the steps of: feeding print media along the media feed direction past a first printhead positioned furthest upstream in the array, a third printhead downstream of the first printhead and a second printhead positioned furthest downstream in the array; printing a yellow ink onto the print media using the first printhead; printing a black ink onto the print media using the third printhead; and printing a cyan or magenta ink onto the print media using the second printhead.

Method of multi-color pagewide printing with optimized nozzle hydration

A process for filling one or more etched holes defined in a frontside surface of a wafer substrate. The process includes the steps of: (i) depositing a layer of a photoimageable thermoplastic polymer onto the frontside surface and into each hole; (ii) reflowing the polymer; (iii) selectively removing the polymer from regions outside a periphery of each hole, the selective removing comprising exposure and development of the polymer; (iv) optionally repeating steps (i) to (iii) until each hole is overfilled with the polymer; and (v) planarizing the frontside surface to provide one or more holes filled with a plug of the polymer. Each plug has a respective upper surface coplanar with the frontside surface.

Process for filling etched holes using photoimageable thermoplastic polymer

A method of generating print data for an inkjet printhead having a plurality of ink planes. The method includes the steps of: receiving image data for a print job in a printer controller; retrieving keep-wet pattern data for each ink plane of the printhead, the retrieved keep-wet pattern data being determined using one or more input parameters; generating first print data for each ink plane in the printer controller based on the received image data; merging the first print data with the keep-wet pattern data to provide second print data for each ink plane; and sending the second print data from the printer controller to the printhead, thereby causing the printhead to print an image together with a keep-wet pattern. The keep-wet pattern is defined by a plurality of dots printed at a frequency sufficient to maintain hydration of each nozzle in the printhead.

Method of generating print data for inkjet printhead

An inkjet nozzle device includes a MEMS structure in contact with ink, wherein a tantalum oxide layer is deposited on at least part of the MEMS structure for inhibiting corrosion by the ink.

Inkjet nozzle device having improved lifetime

A multi-color printer has an array of monochrome fixed inkjet printheads aligned in a media feed direction. The printer includes: a first printhead positioned furthest upstream relative to the media feed direction; a second printhead positioned furthest downstream relative to the media feed direction; and a third printhead positioned between the first and second printheads. Each printhead is supplied with a respective ink from a multi-color ink set, the first printhead being supplied with a lowest luminance ink of the ink set and the third printhead being supplied with a highest luminance ink of the ink set.

Multi-color printer with ink plumbing for optimized nozzle hydration

A process for filling one or more etched holes defined in a frontside surface of a wafer substrate. The process includes the steps of: (i) depositing a layer of a thermoplastic first polymer onto the frontside surface and into each hole; (ii) reflowing the first polymer; (iii) exposing the wafer substrate to a controlled oxidative plasma; (iv) optionally repeating steps (i) to (iii); (v) depositing a layer of a photoimageable second polymer; (vi) selectively removing the second polymer from regions outside a periphery of the holes using exposure and development; and (vii) planarizing the frontside surface to provide holes filled with a plug comprising the first and second polymers, which are different than each other. Each plug has a respective upper surface coplanar with the frontside surface.

Process for filling etched holes

An inkjet nozzle device includes a resistive heater element for ejecting ink droplets through a nozzle opening. The resistive heater element includes: an aluminide layer having a native passivating oxide and a tantalum oxide layer disposed on the native passivating oxide of the aluminide layer. The tantalum oxide layer is a relatively thin layer, which may be deposited using atomic layer deposition.

Growing community of inventors

Balmain, Australia

Angus John North