Amp LLC

Angelo V Angeleri

David A Babow

Thomas K Doench

A socket for a flatpack semiconductor package includes an insulative housing with a plurality of terminal receiving channels which open onto an upper package receiving surface. The channels are in lateral communication with apertures which are profiled for receiving tail portions of the terminals therethrough for interconnection of the tail portions to a printed circuit board. The electrical terminals are disposed within the channels with a contact portion situated above the package receiving face for contact with the flatpack semiconductor package leads. The terminals are designed with a lengthened beam section which forms the contact portion which defines the force deflection characteristics of the terminals to be somewhat insensitive to the insertion depth of the carrier. The housing includes latches on the ends of the housing which are rotatable to accept the carrier and which latch the carrier and package within the housing with the leads of the package loaded against the contact portions of the terminals with predetermined contact force. The latches are also rotatable about axes inward of their latching surfaces so that contact portions are wiped and backwiped against package leads. The contact leads are formed such that the barbs are formed from the area which is used as the carrier strip. The contacts also include widened bending portions which allow for stress relief through the bending radii.

Burn in socket for flat pack semiconductor package

A burn-in test socket for use with flatpack semiconductor components is disclosed. The flatpack burn-in socket is especially adapted for use with robotic assembly techniques. The socket comprises an insulative housing with a plurality of terminals adapted to be in registry with leads on a flatpack semiconductor device located in a conventional flatpack carrier. The terminals are doubly reversely formed to laterally wipe the leads during insertion. Electrical continuity of the socket terminals and dynamic electrical testing of the semiconductor device can be probed from above the socket.

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Mesa, AZ, United States of America

Angelo V Angeleri