Sgs-thomson Microelectronics S.r.l.

Sgs-thomson Microelectronics Limited

Angelo Massironi

Carlo Cini

Luigi Sisti

Pietro Della Bosca

This package for integrated devices, to be fixed on supporting plates, in particular on printed circuits, comprises contact pins to be inserted in holes of the supporting plates and to be soldered thereto. To prevent overturning of the package, which may lead to short circuits among the components, at least some of the contact pins are provided with protruding portions defining abutments cooperating with the supporting plate to limit the inclination of the package with respect to the plate.

Package for integrated devices

A metal heat sink baseplate of a resin-encapsulated semiconductor power device, onto which the semiconductor die is bonded, is provided with one or more raised portions near the perimeter of the bound area of the semiconductor die, onto which ground wires may be welded in order to increase the reliability of wire connections realized between ground connecting pads and the metallic heat sink baseplate itself. The raised portions are preferably obtained by deep drawing the metal of the baseplate. A Single-In-Line semiconductor device is shown wherein the deep drawing of the metal heat sink baseplate for realizing a ridge on the assembly face, to be used for realizing wire ground connections is formed in a separation zone between a portion of the metallic baseplate which extends beyond the perimeter of the encapsulating resin body and onto which the fastening means of an external heat sink are arranged, and the remaining part of the baseplate onto which the semiconductor die is bonded. The deep drawing performed in this zone is also instrumental in providing a mechanical decoupling between the two portions of the metallic baseplate for reducing transmission of flection stresses.

Metal heat sink baseplate for a semiconductor device

A process for manufacturing devices with improved connections between the pins and the semiconductor material chip which integrates electronic components. In order to allow the integration of signal components and power components in a same device with a reduced use of area for the soldering pads and with high reliability of the connections, the connecting wires are made of different materials. Advantageously, the wires for the power connections are based on aluminum and have large diameters, and the wires for the signal connections are gold-based and have a small diameter. In order to ensure good soldering, the ends of the pins on which the connecting wires are to be soldered are gold-plated.

Process for manufacturing integrated device with improved connections

An integrated device with improved connections between the pins and the semiconductor material chip which integrates electronic components. In order to allow the integration of signal components and power components in a same device with a reduced use of area for the soldering pads and with high reliability of the connections, the connecting wires are made of different materials. Advantageously, the wires for the power connections are based on aluminum and have large diameters, and the wires for the signal connections are gold-based and have a small diameter. In order to ensure good soldering, the ends of the pins on which the connecting wires are to be soldered are gold-plated.

Integrated device with improved connections between the pins and the

The outer portion of a die stamped metal frame encompassing the outer ends of the electrical connecting pins is subjected to press striking for re-establishing planarity and parallelism of the opposite faces of the patterned pins which have become deformed during the die stamping, before proceeding to the assembly operations. The eventual bending of the pins of the finished product between a bending punch and a contrasting punch is performed on pins having planar and parallel faces thus preventing twisting and slanting of the bent pins.

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Concorezzo, Italy

Angelo Massironi