Henkel Kommanditgesellschaft Auf Aktien

Chemplast, Inc.

Angela Rossini

Roberto Leoni

Werner Gruber

Juergen Wichelhaus

Reimar Heucher

Norbert Wiemers

Bettina Becker

Italo Albini

Thomas Moeller

Thomas Huver

Siegfried Kopannia

Kurt Schueller

Georg Schubert

Francesco Meda

Massimo Taccani

Carmine Di Fiore

Fabio Berti

Polyamides based on reaction products of C-Cdicarboxylic acids and diamines are suitable as molding compositions for the production of moldings in the low pressure injection molding process, and for adhesive sealing or filling in the production of electrical or electronic devices, in particular of plugs, cables, switches, sensors, transponders, modules, printed circuit boards or smart cards. In comparison with conventional molding compositions based in known hot melt adhesives, said polyamides exhibit higher strength values, higher abrasion resistance and higher chemical resistance.

Method for forming moldings from dimer fatty acid free polyamides

Hot melt adhesives are prepared using thermoplastic polyamides derived from polymerized fatty acid components. The adhesives are particularly useful for bonding nonpolar substrates such as poly-&agr;-olefins.

Hot melt adhesives based on polyamides

Use of polyamides as deformation stabilizers for polymers

Polyamide based on dimer fatty acid

Hotmelt adhesive

Methods of producing thermoplastic poly(amide-urethane) block copolymers having excellent flexibility at low temperatures are provided. The methods comprise reacting substantially linear polyamides, the polyamides being based on dimerized fatty acids and terminated by carboxyl and/or amino groups and aliphatic or cycloaliphatic polyethers and/or reaction products thereof with 2,3-epoxypropanol. The reaction products contain substantially no free isocyanate groups or epoxide groups. The invention also relates to the use of these products as adhesives and corrosion inhibitors for metallic and/or wooden materials.

Methods of making and using thermoplastic block copolymers

Methods of producing thermoplastic poly(amide-urethane) block copolymers having excellent flexibility at low temperatures are provided. The methods comprise reacting substantially linear polyamides, the polyamides being based on dimerized fatty acids and terminated by carboxyl and/or amino groups and aliphatic or cyloaliphatic polyethers and/or reaction products thereof with 2,3-epoxypropanol. The reaction products contain substantially no free isocyanate groups or epoxide groups. The invention also relates to the use of these products as adhesives and corrosion inhibitors for metallic and/or wooden materials.

Method of making and using thermoplastic block copolymers

Thermoplastic polyamide resins with improved low-temperature flexibility and improved bonding properties consisting essentially of polycondensates of the following components:

Polyamide of dimerized fatty acids and polyether urea diamines and their

Thermoplastic polyamide resins showing improved substrate adhesion and consisting essentially of polycondensates of the following components:

Polyamide resin from dimer/trimer acid and N-alkyl diamine

The object of the invention are adhesion promoters for plastisols of polyvinylchloride polymers or copolymers, characterized in that they are constituted by polyaminoamidic resins obtained by means of the condensation of:

Adhesion promoters of plastisols, capable of maintaining plastisol color

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Mailand, Italy

Angela Rossini